Electronics Forum | Wed Apr 10 22:23:48 EDT 2002 | davef
IPC-6012A, 3.4.1 has words to the effect of: Hole size tolerance and hole pattern accuracy shall be as specified in the procurement documentation. Our fab says: Standard Drill Sizes Drill Number ||Hole Size ||Finished Hole Size 70 ||0.028" ||0.02
Electronics Forum | Wed Apr 10 22:24:30 EDT 2002 | davef
IPC-6012A, 3.4.1 has words to the effect of: Hole size tolerance and hole pattern accuracy shall be as specified in the procurement documentation. Our fab says: Standard Drill Sizes Drill Number ||Hole Size ||Finished Hole Size 70 ||0.028" ||0.02
Electronics Forum | Tue May 28 13:14:31 EDT 2002 | zanolli
Hello Mark, I'll assume that you are currently wave soldering and would like to eliminate that operation by using pre-forms or press-fit connectors. Solder preforms or solder flux bearing connector leads usually do not require any hole size changes,
Electronics Forum | Thu Mar 06 11:36:37 EST 2003 | O' Connor
Hi, I'm experiencing a problem on a standard part made many times before -Ni/Au finish PCB, Reflow 100% SMD parts. After reflow the gold on the pads does not fully fuse with the solder paste it remains intact on the extremities of the pads, it seems
Electronics Forum | Sat Jun 21 00:37:20 EDT 2003 | nifhail
Most of the capacitors & resistors supplier have implemented Leadfree finished on their components and like it or not, most of the PCBA house already using them in their process. I just got a notice from my component supplier telling me that they wil
Electronics Forum | Tue Nov 11 02:36:56 EST 2003 | Henry Lee
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Wed Nov 12 20:24:45 EST 2003 | Henry
Anyone who has experience in IPC-TM-650 Environment test Method 2.6.3.1? I have a question. It is the procedure to finish electrical connections. According to 2.6.3.1D, there are apparatus which are solder pot, soldering iron and flux. Then solder a
Electronics Forum | Wed Dec 17 09:53:26 EST 2003 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require. If we can�t get proper hole fill after try
Electronics Forum | Fri Apr 23 13:31:20 EDT 2004 | russ
The toes of leaded devices are problematic in fillet formation. A lot of the time they have the copper from the lead exposed so it becomes oxidized and won't readily take solder. Normally this is of no concern if the heel and side fillets are forme
Electronics Forum | Mon Aug 09 15:49:16 EDT 2004 | celldude
We have definitely seen money saved. There is a lot less rework after reflow. Money is also saved in overtime. for example...when we are building a first article board with many placements, it is not always possible to get the first board through the
