Electronics Forum | Fri May 14 00:16:28 EDT 1999 | Mike D.
| Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | My concern is the volatiles in my WS629 solder paste may be attack
Electronics Forum | Fri May 14 11:24:00 EDT 1999 | Chrys Shea
| Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks | My torque watch came from Waters Manufacturing, Inc. A div of Talley Industries. Longfellow Center, Wayland Mas
Electronics Forum | Fri May 14 12:13:55 EDT 1999 | P.L. Sorenson - Technical Consultant
| | Looking for a reasonably priced portable device to do strength test(shear/twist)on glue cured Cap/Res. Any suggestions? Thanks | | | My torque watch came from Waters Manufacturing, Inc. A div of Talley Industries. Longfellow Center, Wayla
Electronics Forum | Fri May 14 12:13:35 EDT 1999 | Heather
| Hi Guys, | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | So, any of you folks who have already experi
Electronics Forum | Fri May 14 18:29:26 EDT 1999 | Earl Moon
| Hi Guys, | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | So, any of you folks who have already experi
Electronics Forum | Tue May 18 03:17:50 EDT 1999 | Philip B
| | Hi Guys, | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | So, any of you folks who have alre
Electronics Forum | Tue May 18 14:15:59 EDT 1999 | Scott McKee
| | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil, after
Electronics Forum | Wed Jun 30 18:02:53 EDT 1999 | Mark
| What is the best way to re-ball a BGA? Who has the best system for doing it? | To RE-Ball an IC you must re-BALL the IC! The idea of using a stencil to deposit all of the appropriate solder mass can not work. Here is the process (minus the app
Electronics Forum | Thu May 13 00:34:49 EDT 1999 | Jeff Sanchez
| WARNING: This is a plug. | | I have read post on this site where the question is raised: "My machine can do 80 units per hour, but I am only getting 35 - WHY?" | | Well I have written w95/database code that reads FUJI output files (CPII,CPII,IP2
Electronics Forum | Thu May 13 09:41:25 EDT 1999 | Chrys Shea
| | WARNING: This is a plug. | | | | I have read post on this site where the question is raised: "My machine can do 80 units per hour, but I am only getting 35 - WHY?" | | | | Well I have written w95/database code that reads FUJI output files (CPII
