Electronics Forum | Mon Feb 07 13:00:06 EST 2000 | Jose RG
Hi, Last Friday, we had a new defect in our line. We found a nice and shiny solder fillet completelly attached to some component leads (in a SPLCC 84) but the solderjoints were not solder to the pads. (Hasl finishing) Any idea ?? Some contamination
Electronics Forum | Tue Feb 08 03:14:37 EST 2000 | Roni H.
Hi Jose, J-lead are very sesitive to coplanarity, which is the major cause for the defect you described. Other posibility is that there is not enough solder paste ; J-lead need around 10% more solder past then L-lead, You have to consider the screen
Electronics Forum | Tue Feb 08 12:57:42 EST 2000 | Travis Slaughter
I have had the exact thing you describe happen to me, at least it sounds the same. On the PLCC there could be maybe 1 leg not soldered or many of them tending to be in groups but not necessarily. This happened on a established board that had always
Electronics Forum | Sun Feb 06 15:26:32 EST 2000 | Carol Zhang
I have a board which contains brass spacers. The spacers will pass through the wave during soldering. I found a silicon-rubber cap that can prevent solder climbing up into the spacer. However, the cap influence the wave flow and reduce the solderabil
Electronics Forum | Sat Feb 05 12:36:09 EST 2000 | Albert Hay
Hello everyone, I am cosidering the possibility of using Low-Melt solder for repair purposes. However, I am concerned about adding a new alloy (agent) to the board that already has the No-Clean solder on it. Also, is the Bismuth in the Low-Melt comat
Electronics Forum | Sun Feb 06 07:37:29 EST 2000 | Dave F
Albert: Several points: � Bi should have no effect on your no-clean. The flux you select with your Pb/Sn/Bi wire solder could be an area for concern tho. � Bi will form an alloy with Pb with a melting point of 93�C. � Look at "Process Change - Rya
Electronics Forum | Fri Feb 11 14:11:51 EST 2000 | jseagle
To be more specific we have a single Contact 3AV that can run the board in question in 5 minutes from placing the board into the machine till the time it comes out. Volume is expected to be low initially but expected to pick up. It just doesn't fe
Electronics Forum | Fri Feb 04 11:55:08 EST 2000 | Casimir Budzinski
I am looking for a faster way to trim component leads after wave solder. We now cut by hand, we have a Q-cuter but stoped using it the blades dulled quickly and left flags. we just got a cut and clinch locator and hope this will solve some of are pro
Electronics Forum | Thu Feb 03 16:51:54 EST 2000 | Doug Philbrick
I have used a PDR I.R. machine for BGA repair and I personally liked it. The two big features I liked were no special tooling and it has a IR temp probe that is closed loop and will keep the temp where you programmed it. The vision allignment works w
Electronics Forum | Fri Feb 04 11:26:58 EST 2000 | Lisa Anderson
We are currently using an Air-Vac DRS24 hot air BGA/SMD rework unit. Most of our nozzles are designed to channel the exhaust away from nearby components. This and a minimum keepout of .100" has prevented any issues with secondary reflow of those co
