Electronics Forum: gold and plating (Page 36 of 75)

Porosity in Good Plating

Electronics Forum | Mon Jul 07 00:22:38 EDT 2003 | sam

Thanks for all the answers. I should clarify that the problem was found to be on the SMT LED gold plating, instead of PCB gold plating. We had confirmed this problem by running some DOE experiments and some reliability testings. We had decided to d

what is the different between ENIG and Immersion Au

Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef

There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|

Line release of post reflow AOI and AXI

Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon

You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to

Re: Bob Willis Free Advertising and more serious issues

Electronics Forum | Fri Aug 07 07:44:56 EDT 1998 | Earl Moon

| | | No sour grapes, | | | This has gone on too long. I expect no free advertising, nor do I seek it. It is clearly understood Bob is an industry leading consultant. What is not understood, at least by me, how he is allowed to "advertise" so freely

There is a big difference between SMD and SMT.

Electronics Forum | Wed Nov 16 20:17:51 EST 2022 | cyber_wolf

For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of SMT that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of automatical

Re: Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Thu Jun 24 12:43:08 EDT 1999 | Earl Moon

| | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody h

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef

First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so

Re: Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Fri Jun 25 01:11:31 EDT 1999 | Vinesh Gandhi

| | | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody

When to implement high speed pick and place machines?

Electronics Forum | Tue Feb 04 21:07:16 EST 2014 | sarason

You should ask yourself a bunch of questions before you consider going down this path. The first being where are the bottlenecks in your existing line and is there anything you can do to eliminate or decrease there bottleneckness (made up word). I

Flex Circuits reflowing

Electronics Forum | Wed Jul 16 00:15:38 EDT 2003 | iman

just out of curiousity, why the special nitrogen cabinet concerns for gold plated flex PCB? common "myth/fact" is gold is an "inert" coating layer that is not going to react with room environment conditions *that much?*. Am learning here, so would ap


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