Electronics Forum: have (Page 851 of 3489)

Re: Trimming leads

Electronics Forum | Sun Feb 06 07:49:16 EST 2000 | Dave F

Casimir: A comment and a couple questions: * Have you considered a machine that forms component leads to "self-clinch?" With this forming components snap into hole in the boards with the proper finished lead length and requires not trimming after

Power component thermal via

Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel

I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the

APEX will continue in 2001 and beyond

Electronics Forum | Tue Jan 25 15:16:35 EST 2000 | Kim Sterling

SMTNETTERS - I apologize in advance if anyone feels this message is too commercial, but we have been receiving inquiries as to APEX's future after 2000, and just wanted to let the industry know that the event will continue. We have the following c

Machine dropout on SOT23 device

Electronics Forum | Sun Jan 23 03:07:16 EST 2000 | Robert Steltman

We are experiencing 2%+ dropout on one particular SOT23 device. This seems to occur during the actual pickup phase. I have made sure that my pickup position and height are correct. If I single step through the forward feed of the component, viewing i

Solder Paste Testing

Electronics Forum | Wed Jan 19 11:37:18 EST 2000 | Mark D. Milward

Does anyone consider the use of a Cyberoptics LSM solder paste thickness measurement system to be a valid test in determining the viscosity of solder paste. This procedure was proposed as an alternative to using the Malcolm gage for viscosity testing

Re: BGA-2000 Micro Oven

Electronics Forum | Thu Jan 20 15:11:26 EST 2000 | Russ

I tested out the OK unit and found it to be a "down and dirty" rework machine that will do BGAs if demeanding thermal requirements are not needed. My largest concern was the lack of bottom side preheat. I have recently purchased the Air-Vac DRS24 a

Re: Mid Chip Solder Balls

Electronics Forum | Mon Jan 17 08:09:05 EST 2000 | Mark Anderson

As stated previous, the following elements all have a effect on solder beading. Solder Paste, stencil apertures(reduction of home plate), stencil thickness, printing parameters, placement height, reflow preheat and soaking slope and dwell, manufactur

Re: Quad Flatpack Removal Tool

Electronics Forum | Fri Jan 14 09:17:08 EST 2000 | Wolfgang Busko

You need to have the right cutter for that and the necessary skill too. "Erem" a company from switzerland does have a very good cutter for that. I�ve seen cutting done with high speed miniflex ( those dentists tools ) too. Desoldering with a minitip-

Re: PNEUMATIC SCISSORS

Electronics Forum | Wed Jan 05 07:40:06 EST 2000 | jacob lacourse

we have looked into a number of depaneling machines and can't justify the cost. what we are trying to do is to eliminate failures due to part stress when employees are breaking out the boards by hand. I heard about pneumatic scissors one day but to

Re: PNEUMATIC SCISSORS

Electronics Forum | Wed Jan 05 15:00:23 EST 2000 | Brian E. Steelglove

Dear Jacob, I have a company that makes a really cheap but great depanelizing machine and one to get rid of the tabs on a routed FR 4 board. I saw them at the assembly expo in Chicago. The cost is under 2,000 dollars and works well. I think it mig


have searches for Companies, Equipment, Machines, Suppliers & Information