Electronics Forum | Tue Apr 03 13:10:15 EDT 2007 | slthomas
Personally I wouldn't count anything but minutes. You need to know how long it takes to perform each task in order to balance your line. What I'm gathering is that you've got one printer feeding 4 machines, all running different jobs or maybe a pai
Electronics Forum | Mon Apr 09 16:46:54 EDT 2007 | stepheniii
Basically its spec. gives surety regarding its > chemical and physical properties. if he doesnt > follow the spec then may be he may find good > physical soldering appearance but chemically it > may goes down through Electrical or Environmental
Electronics Forum | Tue Apr 03 05:09:04 EDT 2007 | Haris
hi it looks like that you got this machine without money or simply like you robbed it. Even if you buy second hand, atleast you know how it works, SECONDLY WHY YOU DO NOT HAVE ITS MANUAL BOOK. OK, BELIVIEING IN THE ABOVE OPTIONS, if you ON pressing
Electronics Forum | Wed Apr 04 19:27:07 EDT 2007 | davef
The easiest, long term cheapest, and most accurate way to measure top-side temperature is to use one like: * http://www.amazon.com/Fluke-62-Mini-Infrared-Thermometer/dp/B000MX5Y9C/ref=pd_sbs_auto_2/102-7460227-1828165 * http://www.amazon.com/gp/prod
Electronics Forum | Mon Apr 09 14:53:19 EDT 2007 | flipit
Hi, We were running with few defects with lead solder paste. The lead solder paste with stencil 0.010" X 0.020" and 0.004" thick stencil produced near defect free PCB assys. 0.010" X 0.020" (0.004" thick) lead = defect free 0.010" X 0.020" (0.005"
Electronics Forum | Mon Apr 09 16:48:27 EDT 2007 | ratsalad
How wide are your pads? What paste are you using? What is your board finish? Could you please post a link to the datasheet for the component? We place a lot of MLFs, both in a Pb and Pb-free process. Our standard stencil design for MLF compon
Electronics Forum | Mon Apr 23 09:37:20 EDT 2007 | davepick
Assuming you are going to build using a Leaded part on a Lead Free Process - beware of Weak Joints. I saw this at a large Multinational company - They had secondary reflow on a Top Side QFP when the PCB went over the wave. We did pull strength tests
Electronics Forum | Fri Apr 20 18:21:55 EDT 2007 | Hegemon
Consider how the vast majority of PCBs with BGAs are produced. Forced air convection. Anything that comes closer to duplication of the original soldering profile is what you desire. Did they build it with IR or Convection? The process engineer wa
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Sat Apr 14 09:28:58 EDT 2007 | davef
When soldering a component to a board, the solderability protection on the component combines with the solderability protection on the board and the solder to form an alloy. This alloy is unique for that combination of solder and solderability protec
