Electronics Forum | Wed Aug 21 02:11:58 EDT 2002 | kenbliss
Hi Joseph It is not clear what you want us to comment on, however I will take a shot. 1. If the boards you are assembling are expensive it may make sense to strive for 50ppm. 2. If the boards are not very expensive, in my experience you would be
Electronics Forum | Fri Sep 06 14:35:47 EDT 2002 | bobm
I have been in smt for about 4 yrs. I would say you need to evaluate what type of components you are going to place. How many boards your orders will be for. I use Quad pick and place equipment. These are all around good machines for placing everythi
Electronics Forum | Fri Sep 06 15:22:53 EDT 2002 | barryg
Genny, we recently went through the same scenerio. First to consider is your budget. Second , what type of components (fine pitch, bga, chip components)that you would be placing. Also consider board size max. that you would be doing and would see you
Electronics Forum | Tue Sep 17 00:40:39 EDT 2002 | yngwie
Hi all Experts, Desperately need your help on the following questions on Via in Pad and want to understand each of them wrt : - complete Via in pad - partial encroachment - via partially in pad 1) What is the general feel for via in pad for upcom
Electronics Forum | Fri Sep 20 19:06:09 EDT 2002 | mjabure
The way it works is the first index is done with the feed cylinder, and the final is done using the cam during pick. You might want to check to make sure you're getting a full, complete stroke out of your feed cylinder, also make sure the mechanism
Electronics Forum | Tue Sep 17 15:47:42 EDT 2002 | stepheno
Where I worked previously we had some boards with a couple 15 mil pitch parts. The first batch we got all had undersized pads. We had lots of bridging. We had less bridging with bigger pads. The ball size in the paste makes a bigger diffence regar
Electronics Forum | Wed Sep 18 10:06:30 EDT 2002 | Bob M
I place 15-20 mil a lot. You need to look at your pad to apature reduction. Your stencil thickness. The type of paste your using. We use 2-5 mil reduction on each side as a general rule on fine pitch. This varies depending on pad width. We also use 5
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
Electronics Forum | Mon Sep 23 13:08:47 EDT 2002 | dragonslayr
Daan has made a valid point with regards to expertise and use of a machine. Yet I recognize that with advanced technology, trades must occur. A hghly sophisticated AOI unit can and will help reduce overall cost of production. Therefore, a need to ha
Electronics Forum | Tue Sep 24 07:32:58 EDT 2002 | cyber_wolf
Pete: It is a Panasonic Camera. MPM tells me that they no longer sell parts for that vision system, and in order to fix this problem I have to do a vision up-grade. The upgrade is over 20K if I remember correctly. That is not going to happen. I hav
