Electronics Forum | Sat Jul 25 01:15:54 EDT 1998 | Chiakl
| | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For wav
Electronics Forum | Mon Jul 27 13:54:25 EDT 1998 | Ted
| | | | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For
Electronics Forum | Mon Jul 27 13:49:53 EDT 1998 | Ted
| | | | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For
Electronics Forum | Wed Aug 22 21:11:25 EDT 2001 | davef
When it works right, it's a beautious thing. => When goes wrong, you have one board with some of the other board's material, not too coo. Scribed and broken ceramic has bad-butt sharp edges. You'll feel this sticky stuff on your hands, look down,
Electronics Forum | Sun Jun 27 10:48:46 EDT 2004 | crios
I am a Quality Engineer which went from an Automotive QS9000 company manufacturing ceramic hybrid boards and now I am with a ISO PC mfg. company dealing with PCBA boards. I've been assigned a task in determining the contributing factor to high contam
Electronics Forum | Wed Jun 21 07:44:31 EDT 2006 | amol_kane
Hi Muse, what do you mean by "with a SAC Ball and SnPb Paste the ball liquifies at a much higher heat"? Actually depending upon the ratio of solder contributed by the pad (SnPb) to the ratio of the SAC solder contributed by the BGA Ball, the SAC sold
Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip
It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.
Electronics Forum | Thu Feb 15 16:58:11 EST 2007 | flipit
Phil, I used to print solder paste on 2" X 2" and 3" X 3" 96% Alumina substrates all the time. I used standard solder printers and stencils. Screens are difficult to use and don't print well. You can use a stencil on a DeHart, CW Price, or AMI Pr
Electronics Forum | Mon Jul 16 10:17:22 EDT 2007 | realchunks
Yes you can use no-lead parts in a leaded process. Your solder joints will be weaker than they once were unless you change your solder paste. You can try to improve this by running a hotter reflow temp, but be careful since your flux was not design
Electronics Forum | Mon Jan 17 17:38:29 EST 2011 | bandjwet
All: I am reaching out to get some suggestions on the right flux to use as well as a recommended cleaning process for soldering a KOVAR RF shield using 80/20 Au/Sn solder to a ceramic hybrid. The recommended profile is 4-5 min at 280C and at least
