Electronics Forum: index (Page 196 of 7930)

Re: Solderability of fired-silver/platinum/palladium lead terminations

Electronics Forum | Wed Apr 01 02:19:10 EST 1998 | Eldon Sanders

Yes, norm it is. Look back to February 98 discussion on this issue.

SMT Adhesive Dispensers

Electronics Forum | Fri Mar 27 11:44:14 EST 1998 | Ron Beasley

Can anyone give me any input on CAM/ALOT (Gemini) and Universal (GDM) adhesive dot dispensers.

Re: SMT Adhesive Dispensers

Electronics Forum | Thu Apr 02 13:08:40 EST 1998 | Helmut Pawelka

I'll help you if I can. Please write your detailed needs.

Wire Bonding

Electronics Forum | Wed Mar 25 09:01:09 EST 1998 | Harvey Grossman

What is the recommended finish for wire bonding ? Type of AU, thickness, etc. thanx...

Micro Vias in Pads

Electronics Forum | Tue Mar 24 09:26:56 EST 1998 | Jim Kittel

Anyone have an idea how small a via must be to inhibit significant solder volume escaping into the via?

Re: Universal Machines for Sale

Electronics Forum | Mon Mar 16 14:31:08 EST 1998 | Wayne

Where are you located and do you have an email adress, Fax Number and Telephone Number. Wayne

footprint max505

Electronics Forum | Wed Mar 11 06:04:39 EST 1998 | WIM CLASSENS

I'm designing in a MAX505 but i can't find the footprint for this device

wetting

Electronics Forum | Tue Mar 10 22:27:14 EST 1998 | DWR

What does the term "poor wetting" mean as a defect code ?

Pull Test

Electronics Forum | Tue Mar 10 09:13:06 EST 1998 | Olivier de Brouwer

Is there any pull test specifications, or other test to verify the adherence of SMT inductors ?

Re: Pull Test

Electronics Forum | Tue Apr 07 05:48:12 EDT 1998 | bob willis

800 g for a part of that size.


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