Electronics Forum | Mon Oct 29 15:58:47 EST 2001 | davef
Kitting: Buy-in material in kit form that is complete and in the proper form. Line set-up: Layout all boards to be the same width. Printer set-up: Use a dispenser, instead of a printer. Dispenser set-up: Program & debug off-line. Placement machin
Electronics Forum | Tue Nov 27 10:16:07 EST 2001 | davef
Oooo, I get it. We do that trick on the wave solder side of boards. On the bare board, during design / layout, the basic shape of the jumper is a 125 thou disc of copper [that of course is eventually covered with whatever solderability preservative
Electronics Forum | Wed Apr 17 22:17:58 EDT 2002 | davef
OK. I give-up: * �Nuts & Volts� Magazine, September 1997, ENCYCLOPEDIA OF ELECTRONIC CIRCUITS: THE CD-ROM OF 1,000 CIRCUITS � PART 1 - TJ Byers - In this three-part series, TJ will show you how to use this CD to go from concept to copper, and build
Electronics Forum | Wed Apr 24 13:23:37 EDT 2002 | gsmguru
Our design group is looking at using a IMPCB material for a power amplifier design. They would like to to use this because of it's excellent thermal properties. This would be used to create a "SIP" module that would plug into a std FR4 pcb with the c
Electronics Forum | Fri Jun 21 10:22:13 EDT 2002 | russ
A lot of your success with waving SMT components is dependent upon design and what type of wave forms you use. Without knowing how the board is laid out or what type of wave you have it is pretty difficult to determine what the yield differences wil
Electronics Forum | Wed Jul 03 15:58:16 EDT 2002 | davef
Your thinking is correct. Wave soldering pads that were designed for reflow can create problems: * Large pads used for reflow [too much solder] can create reliability problems. * Bridging [too much solder] creates rework. * Skipping & shadowing from
Electronics Forum | Wed Jan 22 13:17:48 EST 2003 | slthomas
We're considering stenciling SMT adhesive to increase throughput. This is an as-of-yet unproven process and for that matter pcb design (we've never done anything with more than about 50 SMT parts on the bottom, this board has in excess of 1200, but
Electronics Forum | Tue Mar 04 18:05:03 EST 2003 | msivigny
Hello Maribel, One way you justify the use of an AOI is to calculate how many defects the system will potentially detect before reflow, associate a repair cost per defect and make the calculation. For an AOI to be effective in this regard, it must sc
Electronics Forum | Thu Sep 11 16:50:18 EDT 2003 | davef
Sure it's conceivable that thin HASL can cause tombstoning. Harkening back to the ample discussion in the fine SMTnet Archives, tombstoning is caused by an imbalance in solder surface tension between the two pads of SMT component. The source of thi
Electronics Forum | Fri Jan 16 07:06:47 EST 2004 | Mika
Component manufacturer often have recommendation for pad layout and process setup. This should be used as a guideline to help You to set up the process. Exactly what type of component is this, uBGA? We populate 64 I/O uBGA's on our pcb's with 0.3 mm
