Electronics Forum: lead-free solder paste (Page 681 of 808)

cleaning of no clean flux

Electronics Forum | Wed Aug 10 08:10:39 EDT 2005 | davef

Comments are: * Sounds like it's necessary to clean "heareous F381, F352 no clean solder paste" in your application. Consider a paste that may be better suited to your application. * If you're cleaning "low residue flux", consider using an organic ac

Need Help for EMI Shielding process

Electronics Forum | Fri Nov 11 09:18:28 EST 2005 | chunks

EMI shields are no fun! Your process will depend on your design and condition of the shields. We always break the shields into their own process. Because the shields are never flat, screen printing paste and trying to reflow them only caused huge

Solder wetting issues

Electronics Forum | Wed Dec 07 14:55:14 EST 2005 | Samir Nagaheenanajar

Here in Rihad, I am in the midst of Pb-Free implementation, and most of our paste manufacturers have advised that with the higher peak temperatures, you need to retain the activators as long as possible. I have changed our profiles to a more gradual

Stencil past height issue

Electronics Forum | Tue Feb 21 21:17:41 EST 2006 | Cal Kolokoy

M, The paste height is what you establish it as. You're probably using a laser measurement system, and these depend on where your reference datum is. Some will measure from a silkscreen, a trace, or solder mask. These add height, not to mention H

Screen Printing

Electronics Forum | Tue May 02 05:59:28 EDT 2006 | davef

We agree with Ken's points about off contact / screen versus stencil, but this DHolt is talking stencil [regardless of what is typed about screens]. Comments are: * On "smears under the stencil": smearing happens. It makes us wonder about the frequ

Poor soldering on fine pitch?

Electronics Forum | Tue Jun 13 17:16:44 EDT 2006 | slthomas

"I believe I was the one who stated in an old post that prying the leads is rediculous." I have been down this road as well. The prez of my previous employer decided that because he could pry .012" leads off the pads with a screwdriver that we had a

Solder Ball After Reflow Process

Electronics Forum | Fri Aug 18 07:37:13 EDT 2006 | Chunks

Hi Umar, I believe you either are over printing these pads or the alignment of board and stencil may be off. Check your print right after your screen printer to verify either. If you are not over printing and your paste alignment is spot on, then

AOI

Electronics Forum | Thu Sep 07 07:38:14 EDT 2006 | travis1977

I have experience programming and using the yestech system in a high volume high mix environment. The system seemed to work well until I used a more sophisticated system. When I changed jobs and had another opportunity to spec. in paste and post-r

Pasting ahead

Electronics Forum | Mon Nov 13 02:04:07 EST 2006 | guess

I suggest to review your board , do both boards have fine pitch QFP's or TSSOP's? . If yes, best approach is to finish board at a time to ensure best quality . You can refer to your solder paste TDS to justify why you choose this approach.

Can someone help me on correcting CAD information on Univesal mc

Electronics Forum | Thu Feb 01 16:33:57 EST 2007 | mika

The reject rate of yours could be a number of reasons. 1. Which component types are rejected? 2. From a particular nozzle? 3. If the rejected part will be dropped on the reject belt or reject bin; it suggests that there is a problem with the componen


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