Electronics Forum: mani (Page 402 of 496)

pc board defects

Electronics Forum | Sat Sep 14 12:24:44 EDT 2002 | scottefiske

We need to remember here that as printer manufacturers were enhancing their product lines, miniaturization was quickly being developed in the background. In the last 2 years I was involved in developing and conducting a D.O.E./F.M.E.A in determining

SMEMA standards

Electronics Forum | Wed Sep 18 16:12:41 EDT 2002 | kenbliss

Hi Dilbert I do not know if you meant to use the words argue in your posting, but assuming it was not sarcastic I would like to offer my point of view as an equipment supplier to people like you. First the customer is not always right but they are

About the PCB gold finger contamination.

Electronics Forum | Thu Sep 19 21:23:42 EDT 2002 | davef

I'm not saying that an eraser will necessarily work. What I'm saying is that some erasers may cause more trouble than the eliminate. Look here http://aic.stanford.edu/jaic/articles/jaic28-02-003_2.html We prefer a brand called Ruby Red. The "ole

Feeder tape size

Electronics Forum | Fri Sep 27 15:07:50 EDT 2002 | barryg

Genny, you may want to look at the brds you will be running and identify the various packages. I do not know what a standard package is. Most chip resistor and capacitors, 0402, 0603, 1206, 1210's are on 8mm feeders, but ic's vary quite a bit. Also r

BGA void removal

Electronics Forum | Sun Oct 20 12:49:11 EDT 2002 | johnw

Dave, I've had a few intersting conversations with Dr Lee, now there's a guy who know's stuff, but as it turn's out even he doesn't have all the answers on why things void. Many of his papers point towards oxides or contamination on the ball, so age

Stencil Printing Process Troubleshooting and control

Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas

Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi

Pneumatic vs Electrical screw drive

Electronics Forum | Fri Oct 18 21:42:04 EDT 2002 | caldon

We did weekly and monthly. Final assembly (Heavy use) recieved weekly. Field service area, sub assembly, low volume, ..... we went monthly. I wrote the ISO specs to read "Calbration of screw drivers to be monitored and logged"( this Simplified of

Soldering an 18 layer 2oz. copper board

Electronics Forum | Sun Oct 20 19:42:29 EDT 2002 | sjpence

Like Russ, I am also curious about the 100% fill requirement. On any thick, high mass board the key is getting as much heat as possible into the board. If you get the board to the proper temperature, solder will flow just about anywhere. As an alte

Dye Pry test

Electronics Forum | Thu Oct 24 14:10:53 EDT 2002 | Terry Burnette

I've been informed that I can't post the Dye Penetrant paper on the SMTNET library till Advanced Packaging releases the paper in their Dec. issue. You should be able to pull a copy in the next couple of weeks from their site, http://ap.pennnet.com/ho

Black pad analisys

Electronics Forum | Fri Nov 08 08:52:54 EST 2002 | dphilbrick

Juan There are many things that cause this and the first thing I would do is request quality records from your board fab facility on that particular lot. If they are unwilling to give them to you this is a good sign they had a processing problem. Th


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