Electronics Forum | Wed Apr 13 16:37:26 EDT 2022 | emeto
I had both in time. Both vendors have great machines. Life warranty on blowers, good build quality, good reliability. From this point it will be personal preference on custom details important for you.
Electronics Forum | Fri May 29 17:19:54 EDT 1998 | Earl Moon
| | | | Thanks Steve- | | Here is the whole story: | | | | The solder balls are appearing all over, similar to a | | splatter. They are relatively small. We are using H-Technologies | | S-HQ no-clean solder paste. The stencil is 6 mil and the
Electronics Forum | Mon Jun 01 14:35:59 EDT 1998 | Rich
| | | | | | Thanks Steve- | | | Here is the whole story: | | | | | | The solder balls are appearing all over, similar to a | | | splatter. They are relatively small. We are using H-Technologies | | | S-HQ no-clean solder paste. The stencil is
Electronics Forum | Tue Sep 07 20:46:55 EDT 1999 | Jeff Ferry
| | | My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | | | My question is what solder temp should be used for this part? | | | Any advice is appreciated. | | | THX. |
Electronics Forum | Tue Jan 30 21:13:26 EST 2001 | davef
Two options: 1 Glue 2 Use a dedicated work holder with 'pockets' milled out to accommodate the components on the first side of the board after reflow. Some prefer a pallet that runs all the way through their process. So, these pallets: * Feature
Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon
| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B
Electronics Forum | Wed May 21 13:26:46 EDT 2003 | Brian W.
Something else to keep in mind when you reflow using an IR (non-convection) oven. IR reflow is more susceptible to variations in board mass and coloration than convection ovens. Hi mass areas and dark colored parts will cause more variation in your
Electronics Forum | Wed Jan 21 12:06:48 EST 2004 | Claude
What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks, Adam Adam, I agree with Pete C. Forced co
Electronics Forum | Mon May 24 17:32:18 EDT 2004 | pjc
Look to the no-Pb solderpaste mfr. specs for on-board temps. For example, Indium Corp. has a product that performs at on-board temps of 229C. Now, your BTU oven will handle this no problem, as will most modern ovens. Its all about thermal mass. Look
Electronics Forum | Mon Jul 19 21:25:28 EDT 2004 | davef
It seems like the flux is burning-up before the metal begins to flow on this slightly odd component. Alpha talks about alternate reflow recipes for WS609, as follows: * A straight ramp up profile is preferred for reflowing low to medium thermal mass