Electronics Forum | Fri Mar 29 08:27:46 EDT 2019 | SMTA-williams
Can anyone help understanding the function of the oil in a bi-components Thermal Interface Material ? After a while, when the material is stored, the oil comes up in the surface : shall we remove it ? shall we re-integrate it into the TIM ? what if w
Electronics Forum | Mon Oct 02 12:22:46 EDT 2023 | carl_p
Hi, I use this Material, you can get a few different types to work with certain sensors but I've used them for a solid 12 months now for reflowing. I'm using multiple board materials down to 0.4mm & I've had zero issues. https://www.datumalloys.com
Electronics Forum | Thu May 27 22:29:14 EDT 1999 | Mike Flori
Does anyone have a suggestion for a UV resistant black potting material? The material recommended by a local vendor turned gray in a couple of months in the sun here in Florida. We are using L.E.D.'s in a small housing (about 1.2" cube) and need to s
Electronics Forum | Tue Apr 13 23:27:34 EDT 1999 | Mike Flori
I need to cure conformal coat on a 19" x 15" board. The material needs 7 - 10 minutes at 100deg C, but I have limited floorspace so I'm looking for an oven with about 36 inches heated length and 18 or more inch wide belt. The material we are consider
Electronics Forum | Wed Apr 14 17:13:08 EDT 1999 | Stephen Oltmann
| I need to cure conformal coat on a 19" x 15" board. The material needs 7 - 10 minutes at 100deg C, but I have limited floorspace so I'm looking for an oven with about 36 inches heated length and 18 or more inch wide belt. The material we are consid
Electronics Forum | Wed Apr 14 17:14:49 EDT 1999 | Stephen Oltmann
Check with BTU. They have dryers in the length you need. Good luck! | | I need to cure conformal coat on a 19" x 15" board. The material needs 7 - 10 minutes at 100deg C, but I have limited floorspace so I'm looking for an oven with about 36 inches
Electronics Forum | Wed Sep 30 12:32:15 EDT 1998 | CHAD HAIMA
I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. | | I would need the material to be of such a nature that I could form a cov
Electronics Forum | Fri Sep 11 17:23:00 EDT 1998 | Eric Miller
Hey Dave, sounds like your material is delaminating at a rapid rate, I would not recommend using them through your process, delaminating material has to go some where! When composite material is made, layers of fibre glass and epoxy resin are placed
Electronics Forum | Tue Aug 25 16:28:11 EDT 1998 | Al Knudson
Hello, Our PWB supplier has requested that a change in the laminate material to reduce the incidence of pad lifting. The standard laminate materials (Polyclad PCL-FR-226 with a glass transition temperature of 135 C) have greater z-axis thermal expan
Electronics Forum | Fri Jun 14 14:32:05 EDT 2002 | davef
There is no real reason why you shouldn�t use your current paste. Paste for printing usually is a coarser mesh than paste for dispensing. Dispensing paste is more expensive, because of the mesh and the packaging, but that doesn�t matter now. Compa
