Electronics Forum | Wed Apr 09 11:42:39 EDT 2003 | stefwitt
Ricardo, I can�t apply more then common sense to the function of the coplanarity system. If Fuji buys the system off the shelf, from Cyber Optics for example, then it is very likely that it has its own processor, programmed a way that the measuring r
Electronics Forum | Wed Apr 30 20:33:15 EDT 2003 | davef
Haaaa!!!! Yes, we�ve seen things like that. We found that a high input impedance amplifier worked fine in a room with a controlled environment and worked poorly in the sweat-shop portion of our plant. We were using good ol� WS609, straight water w
Electronics Forum | Thu May 29 14:21:22 EDT 2003 | swagner
Thanks for the clarification, I have worked with both application, especially pre reflow. The data you should consider collecting pre reflow is missing, skew degrees, x,y shift, bill boarding, polarity and match the failure data (ref. desg.) to feed
Electronics Forum | Fri May 07 16:24:08 EDT 2004 | bruce @ knoll
I did have my solder analyzed and it is clean. The Hollis preheat coils are a bit hard to control but I have measured the board top side and I am getting a temp of 105c just before wave contact. I would like to move to a spray fluxer but I am going
Electronics Forum | Wed Jun 11 12:29:19 EDT 2003 | JB
There are many variables that could cause components to be misplaced. Using the overall tack time reduction is in reality putting a band-aid on a larger problem. Are your small components shifted as well? ( 0402,0805 tec) Components "twisted or off
Electronics Forum | Fri Aug 08 12:46:02 EDT 2003 | davef
When I was a salty old fart in the Navy, we sent the babes from the turnip patch off on snipe hunts. Shear tests are [in my opinion] senseless. The shear stress you measure depends more on the shear rate and on the point where the force is applied
Electronics Forum | Tue Sep 09 20:32:10 EDT 2003 | davef
The maximum ratio of gold weight to solder alloy weight can be calculated, to help prevent a problem from excessive gold-tin intermetallic compound (i.e., AuSn4). For the equation and its derivation, please refer to "The Use of Capillary Action Measu
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Sat Mar 20 08:37:06 EST 2004 | Primus
The BioAct SC-10 wipes work great, but I've noticed some contamination in our solder joints after I began using them on the stencils. After cleaning the paste off the stencil with the wipes, I started spraying the stencil down with isoproponal and bl
