Electronics Forum | Tue Jun 20 14:19:04 EDT 2000 | Chrys Shea
Hi Mike, The Hadco design guidelines are really good - I was just there. To expand on what Dave said, scoring is an option, but I've never had good luck with it, myself. The scores are either too shallow, and I can't break the boards easily enough
Electronics Forum | Thu Apr 19 21:49:29 EDT 2001 | davef
SCREENING... 1. Is type 4 paste necessarily required? [No, not unless you are using it for some other purpose.] 2. Is No-Clean Ok to use? [YES] 3. How thin stencil is required? 5 mils? [5 is OK, but I wouldn�t base the decision on the 0201. 6 mil is
Electronics Forum | Sun Sep 12 10:08:55 EDT 1999 | Earl Moon
| hello | | having a problem with one customers bare boards not matching my stencil apertures. i design stencils based on gerber data and reduce up to 15% on some pads. do some board houses reduce pads after receiving gerber data???why would they d
Electronics Forum | Mon Sep 13 04:11:27 EDT 1999 | Earl Moon
| | hello | | | | having a problem with one customers bare boards not matching my stencil apertures. i design stencils based on gerber data and reduce up to 15% on some pads. do some board houses reduce pads after receiving gerber data???why would
Electronics Forum | Mon Sep 13 12:19:42 EDT 1999 | Earl Moon
| | Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. | | | | For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid-
Electronics Forum | Tue Jul 27 16:22:17 EDT 1999 | Earl Moon
| I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. | | The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the
Electronics Forum | Fri Jun 18 11:33:16 EDT 1999 | Brian wycoff
| | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads.
Electronics Forum | Sun May 23 15:12:59 EDT 1999 | JohnW
| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor
Electronics Forum | Mon Mar 01 22:24:53 EST 1999 | Dave F
| It seems to be that we have to much NaCl left on our assambled PCB's. | The flux we use is from cobar. They say it can not be from the flux... So what can be the reason, what kind of problem may occer when there is to much NaCl. | George: When so
Electronics Forum | Mon Feb 22 14:21:14 EST 1999 | Rick Wyman
| | Hey all- | | | | My question is this: My stencil printer operator has said that he has to | | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 |
