Electronics Forum | Thu Jun 01 16:30:05 EDT 2006 | slthomas
Just wondering if anyone knows this off the top of there head. I might be able to figure out the math based on surface tension (this is 63/37 so the data is out there) but I REALLY do not want to put that kind of effort into this. :/ Editing to clar
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Wed Jun 07 10:56:38 EDT 2006 | Chunks
In the past, I would normally tell out highly talented inspectors to leave the balls there. The were trapped in the flux residue and were hard to remove. Never caused a problem. But then there was an incident where someone had the bright idea to u
Electronics Forum | Thu Sep 20 14:20:46 EDT 2012 | blnorman
From what I was told, gold flash normally refers to 10 microinches of gold.
Electronics Forum | Thu Sep 20 10:05:35 EDT 2012 | guyramsey
What is the state of the art in electroplated gold flash a a surface finish; thickness and tolerance limits?
Electronics Forum | Fri Sep 21 10:35:37 EDT 2012 | davef
Flash gold is just thin electrolytic gold plating over electroless nickel or electrolytic nickel. Flash gold plating ... * Less than 3 microinch thick will be porous and take solder poorly * Greater than 10 microinch thick will cause brittle solder c
Electronics Forum | Mon Sep 24 10:07:46 EDT 2012 | eezday
The answer, as stated above, is 3 microinch's however, it is equaly important, if not more important, to understand that the only function of the gold is to protect the surfaces beneath it. Only enough gold to cover the nickel beneath it should be u
Electronics Forum | Thu May 06 12:42:53 EDT 2021 | amaliahx
We are interested in buying a minimum 50K+ z-wave chips 700 series . Please email me : amalia@pcbstartech.com Thanks
Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29
Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi
Electronics Forum | Mon Sep 18 11:55:35 EDT 2000 | Ricardo Fuentes
Hi! cold someone advise me about the minimum gap allowable in between 0404 parts. The minimum distance is because of the behavior on reflow, the re-work difficulty or anything else. Thanks
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