Electronics Forum: model (Page 148 of 177)

Re: Dross Skimmin'

Electronics Forum | Tue Dec 01 13:53:12 EST 1998 | Brian Conner

| | | | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect solder

Re: Dross Skimmin'

Electronics Forum | Wed Dec 02 09:03:34 EST 1998 | Dave F

| | | | | | | All y'll: I could use your input on determining when to skim dross from a wave solder pot. | | | | | | | | | | | | | | On one hand, dross protects the surface of the solder from oxidation. On the other hand too much dross may affect

Re: Starting an SMT line

Electronics Forum | Tue Sep 08 13:33:07 EDT 1998 | Brad Kendall

For pick and place, I have worked with the Zevatech machines and Philips machines. Both are great machines. The Zevatech will give you greater speed and still offer great accuracy and repeatability. Don't let the belt drive stuff scare you, it sta

Post Script

Electronics Forum | Tue Sep 01 10:39:30 EDT 1998 | Mike

| | | We are experiencing shorting on a BGA. The part has a 1mm pitch with a 196 I/O count. The problem seems to pop up without warning & disappear in the same manner. | | | Our pad design is .020" diameter pads with .025" solder resist diameter.

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan

Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op

BGA Rework

Electronics Forum | Thu Apr 10 09:28:14 EDT 2003 | chrissieneale

Thanks for your replies guys, there's some good info there. Dave, answers to your questions: The stencil was initially a big problem as with the Egineering Model's (EM's) and Engineering Qualifing model (EQM's) we kept getting short circuits due to

Yamaha/Philips Model Number Cross References

Electronics Forum | Thu Jul 07 19:39:18 EDT 2005 | darby

This is a very difficult question to answer as it will depend greatly on your component mix. I will presume that the CSM 84VZ is of the following configuration: 2 x RDC Synchro Heads. Heads 1 & 2. These are mechanically centering heads with a chucki

QFP Shifting / Solderability Issue

Electronics Forum | Fri Jun 01 22:49:50 EDT 2007 | mika

These ones from ALTERA the QFFP-304 0.5mm weight: 32gr. used to give us a really headache in the past. Not only soldering issue:s but also the placement in x-y-theta! The stencil thickness of ours is 0.13mm and because of ohter compomponent packages,

MPM Accuflex questions and issues

Electronics Forum | Thu Feb 15 13:46:16 EST 2018 | aemery

Griinder, Maybe it's me, but I think what you might be saying here is that you see a reflected image of the PCB or Stencil when you and teaching the fiducials and it is interfering with the teaching routine, is that correct? If this is true it is c

Re: World Class: Is it a philisophical question?

Electronics Forum | Mon Oct 09 17:49:29 EDT 2000 | sean

Hello John, The biggest stumbling block is going to be taking these responses and applying them to your assembly process much the same as trying to make other manufacturers' defect levels apply to your process. Ultimately, the overall quality of yo


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