Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Wed Aug 02 14:13:39 EDT 2006 | BillB
Sorry, can�t help much as my memory is getting dim. It seems that the first stage took place with a small blower after/during the time the board went thru a heater module. Can�t remember were the intake for this blower was. It seems to me that the
Electronics Forum | Wed Aug 23 09:25:32 EDT 2006 | SWAG
I just installed a new CCD in a 4.0 mil upward looking camera - GSM. It's working well but is slightly out of focus. Do I adjust focus by moving the lense in and out of the camera mount or do I use the ring that is actually part of the camera that
Electronics Forum | Tue Sep 12 12:47:07 EDT 2006 | james
I am looking for a Surface Mount Machine that can handle a board that is 24 inches long and 7.5 inches wide. Please if anyone has suggestions, they are greatly appreciated. Also must be able to handle over 50 feeders of various sizes. Thanks
Electronics Forum | Fri Sep 15 12:30:05 EDT 2006 | Steve
If the package is robust enough to handle surface mount followed by a pass through the wave soldering process, we have had excellent results populating the fine pitch parts with the P&P machine, reflow, then mask the solder joints prior to wave solde
Electronics Forum | Tue Oct 03 13:08:39 EDT 2006 | Moby
This is an issue that we are seeing a lot! It used to be that the primary-side (component-side...top-side) had most of the active components. It was simple: reflow bottom first. Now, we are seeing both sides of the assembly having the same amount of
Electronics Forum | Wed Oct 11 15:40:34 EDT 2006 | Steve Gregory
Don't think there's any easy way to clean under a LCC, but you might want to consider this: http://www.winslowautomation.com/ccmd.asp A dead simple way to mount solder columns onto LCC's and then solder the part to the PCB with a stand-off of abou
Electronics Forum | Thu Nov 16 18:41:17 EST 2006 | John Fisher
Unidec repairs of industrial electronics specializing in the surface mount (SMT) and through-hole circuit board equipment, robotics, vision systems and general automation. Plese see our website at http://www.unidec.com of call toll free at 888-701-00
Electronics Forum | Fri Oct 20 04:07:15 EDT 2006 | Base
I know that on Philips Topaz equipment you can define the XY locations of the individual local fids relative to the mount-center of the component that they apply to. So if they are not symmetrical w.r.t. to the QFP's center there's no harm done. You
Electronics Forum | Thu Oct 26 14:43:09 EDT 2006 | Billabong
We are having difficulty with thermal deformation of these AMP surface mount connectors. It is a RoHS compliant part, but only rated to withstand 245c for 10-30 seconds. Even at this temperature, we are seeing PLASTIC deforming which prevents mating
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