Electronics Forum | Tue Feb 09 16:53:06 EST 2021 | SMTA-64387083
The size of the pad changes among the two. A solder mask defined pad will always be larger than a copper defined by your mask expansion setting. This will affect paste volume, if your standard paste aperture is designed for copper defined pads you m
Electronics Forum | Tue Feb 17 15:24:17 EST 2009 | glynnhamer
I know this is going to sound rather sad, but we have been using a Capton tape for years that contains silicone to mask large components as they go over the wave, as well as large plated holes on the pcb. It was handed down for years as accepted prac
Electronics Forum | Wed Apr 26 01:18:33 EDT 2006 | ge_lim
Hi We are in the process of developing a lead free product to be used in a non lead free selective soldering machine, i do have concern in these, and hope you guy can share your experienced expert opinion: 1. What does it take to convert to lead fre
Electronics Forum | Thu Feb 21 09:53:00 EST 2013 | Mr_Bo_Jangles
Has anyone used their AOI to try to catch components that may be inadvertently placed in a location it shouldn't be? Every once in a while our equipment may drop a part onto a PCB and that part will adhere to pad. So the question has been brought u
Electronics Forum | Wed Apr 26 07:37:34 EDT 2006 | amol_kane
"Can we reuse the same machine? My point here is that the non lead free process has already coated the machine interior ( exhaust, internal flow ) with leaded component, and by conversion to lead free are we containminating the lead free product from
Electronics Forum | Wed Apr 26 07:37:52 EDT 2006 | amol_kane
"Can we reuse the same machine? My point here is that the non lead free process has already coated the machine interior ( exhaust, internal flow ) with leaded component, and by conversion to lead free are we containminating the lead free product from
Electronics Forum | Thu Feb 21 11:38:00 EST 2013 | pbarton
We are a CEM and do exactly what you describe i.e. teach the image of a non-populated part and apply to all no-fits for that package style. Works very well with our equipment (Yestech)provided the visual signature of all your parts are sufficiently d
Electronics Forum | Thu Feb 21 11:22:06 EST 2013 | emeto
It is a very interesting thought. However, teach all positions on the PCB might be challenging if you don't have them in the file. I think it is a smart think for OEMs as they would have all the resources to control their files. For CEM I don't see i
Electronics Forum | Thu Feb 28 10:40:56 EST 2013 | rway
I have been doing this since day one of getting the AOI. It just seemed logical. I don't know what type of AOI you have, but what I have found works best is to use solder inspection to catch parts that are loaded into a no-load location. Move the
Electronics Forum | Wed Oct 27 19:50:59 EDT 1999 | chris
Hi What is the possible cause of non-wetting of solder paste to the gold land pad. What we observed in the surface of the non-wet pad is an organic FM, and using FTIR we found out that it is a flux. It is possible that the cause of non-wetting is
