Electronics Forum | Fri Sep 10 17:32:59 EDT 2004 | Yngwie
We have recently faced lifted lead problem that happened on our 20 mil pitch QFP. We have infact pushed it back to the incoming quality, but still I have a few questions to bring up : 1) what is the typical coplanarity tolerance that ICs' manufactur
Electronics Forum | Thu Nov 04 09:00:01 EST 2004 | russ
As stated by others you are out of IPC compliance, However, There are allowable deviations to the standard as long as the purchaser and manufacturer come to agreement that the non-conformance will not affect form fit or function. I would recommend
Electronics Forum | Mon Jan 10 18:16:32 EST 2005 | ricardof
Greetings from Mexico I can see several good opinions about the "real" need to chnage to Lead-Free processes, but at the end and trying to be real, is there any good path we could follow to stop this process? I can see a lot of work, investment in eq
Electronics Forum | Mon Dec 20 21:01:12 EST 2004 | davef
Bare inconel is NOT ment to take solder, because * Nickel develops a tenacious oxide layer that is very difficult to remove since the nature of the oxide is very dense, coherent, etc. * Chromium is difficult to solder. * Iron is difficult to solder.
Electronics Forum | Wed Dec 22 23:29:57 EST 2004 | KEN
Check with Dupont's web site. They have a wealth of information on the various polyimide products they manufacture. I was quite surrised at the differences in materials and in particular the dimensional stability and hydroscopy. Good stuff mayna
Electronics Forum | Tue Apr 05 08:16:30 EDT 2005 | jax
This is not a built in function, you have to trick the machine. 1. Determine what you want to use to play "whack-a-mole" Regular or Modified nozzle. Regular will most likely get damaged from multiple "whacks" 2. Teach the nozzle
Electronics Forum | Wed Apr 06 11:58:02 EDT 2005 | patrickbruneel
Hi SMT Engr With a double-header connector do you mean Double Level Right Angled Header Connector. If so there is a big difference in heat sinking capacity between the two rows, as where the pins of the top connector absorbes twice as much heat as t
Electronics Forum | Wed Apr 06 22:59:02 EDT 2005 | smt_rookie
It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did not wet well along the connector pins. Before reflow, the paste is actually at the tip of the connector, and stayed there and never went up to fill th
Electronics Forum | Wed Apr 13 08:01:32 EDT 2005 | Bryan
Can you please decrease the ramp rate of your reflow profile?In my opion,if you heat the pin too fast,the solder will drop for the gravity and the cappilary force can't draw it back.On the row with much heatsink,this issue won't happen,that's the rea
Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef
Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the
