Electronics Forum | Sat Mar 29 08:42:25 EST 2003 | davef
YiEng, MA/NY DDave There are numerous package types that now fall under the rubric of land grid. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. General
Electronics Forum | Thu Apr 03 11:36:54 EST 2003 | stefwitt
I don't know too much about Fuji, but I'll try myself anyhow. How is the coplanarity unit communicating with the machine controller? Attach a logic analyser, second listener or data analyser and "listen" to the communication with the machine contro
Electronics Forum | Mon Apr 28 11:23:42 EDT 2003 | David
Can anyone help me with a problem I am encountering on specifying the surface finish on a new BGA System in Package module. So far I have been advised to look at a palladium / nickel / gold solution but does that have any advantages over nickel / gol
Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef
ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take
Electronics Forum | Wed Jul 16 09:55:05 EDT 2003 | swagner
To answer the first post after my initial response we haven't published any of our lead free data since it is proprietary, sorry. As for the nitrogen cabinet it has been proven that over time the Gold plating can build up a layer of oxides that can
Electronics Forum | Sat May 24 00:43:59 EDT 2003 | iman
Our engineers did a study on our medical product with 1mils standoff height, and one issue was 100% of the boards that underwent ultrasonic failed due to failure of the package wirebonding. Poor reflow control would be one area to review in any event
Electronics Forum | Thu Jun 19 20:09:19 EDT 2003 | John Tobias
I'm new to this forum. I hope that this isn't an old topic. Sales people in my company have told me that there is resistance to the use of QFN (LPCC) packages by small Asian (primarily Korean Repeaters and Chinese CATV) manufacturing houses. Does
Electronics Forum | Mon Jun 30 22:02:43 EDT 2003 | davef
If you don't seal your packaging, the silica gel will try to remove the moisture from the air and will become saturated pretty quickly. There is no requirement that you pack/ship with dessicants. Some customers require such things though. Why do y
Electronics Forum | Tue Jul 01 08:50:08 EDT 2003 | davef
ESD Association regional sites. For instance: * http://www.esdnw.org/asktheexperts.htm * http://www.esdsiva.org/ * http://www.centxesdassoc.homestead.com/ ESD protection supply providers. For instance: * http://www.desco.com/askEsd.htm * http:
Electronics Forum | Tue Jul 15 16:31:11 EDT 2003 | GerberGrab
If you just need gerber to placement list processing, then you might be interested in GerberGrab. It's not as sophisticated as the more expensive packages that include this capability, but it's getting better all the time and it's much more affordabl
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