Electronics Forum | Wed Dec 16 19:37:19 EST 1998 | Ron Costa
I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 14
Electronics Forum | Tue Jan 08 14:58:33 EST 2002 | edmentzer
It sounds like an interesting idea. I have ask MYDATA about a user group, but they always act like it would not a good idea. I think every user has something to share or a question that could answered by someone who has "been there done that". We
Electronics Forum | Mon Apr 01 15:55:31 EST 2002 | jax
Alright Dave, I need your special search engine on this one. I am looking to see if there is any way to convert package dimension information ( length, width, lead count, etc..) into one of the following: 1.Gerber, 2.GENCAD, 3.IPC-D-356 I would like
Electronics Forum | Wed Apr 10 22:25:29 EDT 2002 | davef
BAKING MSD AT 5% You can bake at any RH% you�d like. The further you get from 5%, the longer it takes. Those guys in production are just bustin� ya. For background, look at: * http://www.seikausa.com/mcdrysmt.pdf * http://www.aecouncil.com/Papers
Electronics Forum | Mon Jul 15 12:54:28 EDT 2002 | kenbliss
Hi James If I understood you correctly, you have this problem also but you acknowledge its not the component vendor making the mistake it is purchasing not ordering soon enough in the right package or accepting whatever they can get. I would think
Electronics Forum | Thu Aug 21 16:58:25 EDT 2003 | justin
With a eutectic ball, you'll see about a 50% collapse. This negates that .008" issue you're referring to. With a high temp ball, you don't enjoy the same freedom regarding ball collapse. Dave is correct, though. We recently got IBM to sign up to
Electronics Forum | Mon Oct 13 13:10:06 EDT 2003 | cyber_wolf
We have Mydata's and I know exactly what you mean. If you are starting from scratch I would suggest that you get yourself a photo album or something similar. When you get a new part, name the package and stick it in your album with the package name a
Electronics Forum | Tue Jan 06 15:57:30 EST 2004 | dbdavis
Dear Colleagues, I am evaluating the Linear Tech. Corp. LTC1733 MSE Package for use in our SMT Dept.. For this application I will need to consider the possibility that we will be required to repair these devices after some time in the field. My probl
Electronics Forum | Wed Mar 31 13:05:46 EST 2004 | JoeH
Anyone used this package? It's Cygnal PN C8051F300. The part has bottom side, flat terminations (like a BGA without the balls). There is metalization on the sides of the package but it's not plated (bare copper). Metalization on the bottom is pla
Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
