Electronics Forum | Wed Feb 23 09:33:03 EST 2005 | rlackey
Hi, Does anyone have any experience of using electrically conductive adhesives, including info on the following? 1) Autodispensing/screen printing 2) Curing temps/profiles 3) Quality/conductivity of joint 4) Product recommendations Our customer w
Electronics Forum | Mon Feb 28 06:06:04 EST 2005 | Guest
I'm looking for recommendations on pad and stencil design for products with 0.5 mm pitch BGA's. The latest info that I found in the archives of this forum dated more than a year ago. It didn't give me much confidence that assembly of such components
Electronics Forum | Sat Mar 26 08:30:01 EST 2005 | davef
Consider this: * SolderQuick Winslow Automation-type [ http://www.winslowautomation.com ] preform * When LGA first came on the scene, we didn't have a clue. After trying sockets, we printed paste on the pads bug-up, reflowed, and then the placed the
Electronics Forum | Mon Mar 21 12:02:09 EST 2005 | Rob
Hi Colin, Are you using the 1206 package with 4 elements or one of the higher density smaller packages? With the first type you can get them in both Convex or Concave terminations, with most of the solderability problems associated with using the C
Electronics Forum | Wed Apr 06 21:37:35 EDT 2005 | KEN
Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? This means your thermal profile is not hot enough. why the sudden cahnge? I will bet the lead frame material was copper and is now alloy 42. sounds like
Electronics Forum | Mon Apr 11 02:58:49 EDT 2005 | Base
You might want to take a look at some of the Assembl�on/Yamaha stuff. I believe they have a machine that has a couple of dispense heads and a couple of placement heads, so you can get your solder-paste and component-placement all done in one machine.
Electronics Forum | Fri Apr 08 12:03:31 EDT 2005 | mmjm_1099
Here we go again..... check all past forums on Lead-Free. There is a TON of stuff that people has talked and commented on for this. Plus a good site for alot of information I found is: http://www.speedlinetech.com/news_publications/white-papers.aspx
Electronics Forum | Thu Apr 14 05:23:10 EDT 2005 | dj_jago
What is the pitch of the device and what type of flux are you using? You may eridicate the fault by using a more active flux. I assume you are flowsoldering the device as opposed to paste in hole. Do you have an air knife? If so, you could tr
Electronics Forum | Tue Apr 26 11:22:48 EDT 2005 | denismeloche
I have found that Sn62 solder gives better strength and leach resistance when soldering to gold surfaces. The gold needs to be at least 5 to 10 micro inches thick to prevent nickel oxidation but if over 25 micro inches will cause brittleness. I hav
Electronics Forum | Wed Apr 27 13:17:14 EDT 2005 | grantp
Hi, That was one of the recommendations made when I had the problem, but I never followed it up. Would the outside corners of the square aperture be on the edge of the pad, so you would be putting down less paste on a smaller aperture, but it's sq
