Electronics Forum | Wed Dec 14 08:08:42 EST 2005 | Champ Kind
Snaggletooth, I spent a good portion of my career fighting solder shorts on BGA's and QFP's, tombstones on 0402's, solderballs on passives, etc.. I've solved just about all those issues, and didn't solely rely on my stencil manufacturer... Your ste
Electronics Forum | Mon Dec 19 08:56:18 EST 2005 | davef
Q1a. If the thickness of the silver is too much (how is too much??), A1a. We have heard stories of using Ag2 to limit silver [or gold] dissolution, but have never seen formal studies to demonstrate that idea. First, exclude the use of silver plate
Electronics Forum | Thu Dec 22 12:05:37 EST 2005 | Tony
Currently we are using a 2 step vapor soldering process to manufacture our std. lead soldered parts. The first step was done with a ls240 vapor fluid and the second was done with a ls200 fluid. Using a 221 deg C sn95/Ag5 solder for the first step a
Electronics Forum | Sun Dec 25 18:54:04 EST 2005 | mariss
We are experiencing fracture problems with 0805 X7R capacitors. The capacitors seem to fail in tension; during hot-air rework they come apart in two pieces with the fracture near the metallization end. Only X7R SMT components are affected, C0G and Y
Electronics Forum | Tue Jan 03 06:51:50 EST 2006 | Slaine
Is this a new design or have you manufacted these in the past without a problem. we manufacture ceramic arrays from X7R and COG, X7R has a differnet dialectric strength so higher capacitor values can be achived. With the introduction of RoHS the term
Electronics Forum | Tue Jan 03 17:14:37 EST 2006 | mariss
To recap: 1) The machines use laser centering, not mech jaw centering. 2) The X7Rs are scattered on the board, center and edges. Improper de-panelization would favor damaging the parts near the edges of the board; this is not the case. 3) Both ROH
Electronics Forum | Mon Jan 16 16:19:22 EST 2006 | davef
Dunno. 4% higher standoff results in 16% higher reliability [�The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability� Banks, Donald R., et al.; Proceedings of the Technical Program - Surface Mount International; September 10-12,
Electronics Forum | Mon Jan 30 16:30:55 EST 2006 | GS
Hi James, it could be the problem is due to residual of cleaner media entrapped under low gap of QFP 208 and 0,5 mm lead pitch. I remember in the past we had random problems of failure at test after board wash off process (DI Water wash). We met
Electronics Forum | Wed Feb 01 08:12:04 EST 2006 | Chunks
OK, this is easy. You say HIGH fall out, so I can assume 25 or 50%? If so, run 10 without the heat gun and 10 with. This should show you if the heat gun process is the cause or not. If the relay is a surface mount, hand solder them on. If it's a
Electronics Forum | Wed Feb 01 12:20:16 EST 2006 | cvoyles
Hi Bruno, I am an equipment reseller in business since 1994. I have a Smart Sonic MG3000 ultra sonic stencil cleaner in inventory. It is a stainless steel model with Delta Sonics brand ultra sonic generator. It is the guillotine type that raises a
