Electronics Forum | Wed Feb 26 18:48:01 EST 2003 | kennyg
I'm trying to solder a 0.011" lead into a 0.015" +/-0.003" hole. Stop laughing please. This is normally possible with difficulty, except if the lead is removed and the attempt is made to re-install a lead. Anyone have thoughts on how to remove nea
Electronics Forum | Sun Mar 02 17:40:02 EST 2003 | MA/NY DDave
Hi It sounds like you are in a different country or in the USA a long time ago. I have no idea of the process either is using, so they can be comparable or one can be better than another and lop sided compared to other places. Benchmarking I think
Electronics Forum | Thu Mar 06 22:34:55 EST 2003 | davef
O' Connor: Are you saying that: * You solder fine in the areas where you print paste * You solder poorly in the areas where you don't print paste Aside from that, the gold on these pads seems to be less bright than previous lots. [if that's not it
Electronics Forum | Fri Mar 21 11:25:07 EST 2003 | jonfox
His subject line is "Tantalum caps causing misaligned parts". Come on guys, I think he answered the question already. Is there any via/traces that connects the pads of the TANT to the 0805 and the BGA. Your two parts may be physically the same, bu
Electronics Forum | Tue May 06 20:43:31 EDT 2003 | MA/NY DDave
Hi Our SMTnet buddy DaveyF already gave a better and faster reply than I can give at present. Let me give one answer to your question without checking DaveyF's formula which is probably a true equation. DaveyF can always correct me. As you can see
Electronics Forum | Fri May 16 15:45:00 EDT 2003 | swagner
If the only difference between the two products is the board supplier I believe thats where I would start, we had a similar problem like this two months ago and it turned out to be a faulty (thin) HASL layer which did not meet our print tolerance. T
Electronics Forum | Tue Jul 08 18:53:21 EDT 2003 | MA/NY DDave
Hi The answer in general is no mixing of Lead Free with Sn/Pb solder. If you look at reliability data, failures after stress tests and then SEMs, failures occur at grain boundaries inside the joint. Lots more happens. By the way this mixing happe
Electronics Forum | Wed Aug 06 20:50:42 EDT 2003 | davef
Well, if it "keeps coming up", let's take a pass at keeping down. For: * Requirement that gold be removed from components, pads, etc. is J-STD-001C, 5.4.1 * Context of that requirement [J-STD-001C, 5.4.1] and 6 or 7 references are in IPC-HDBK-001.
Electronics Forum | Fri Aug 08 08:00:46 EDT 2003 | davef
Matt: You're correct. Do not mess with these boards. If the immersion tin [imm tin] is discolored, it will not solder with routine processes. Ask your customer to return the boards to his / her fabricator and have the imm tin replated. The fabri
Electronics Forum | Thu Aug 14 14:01:03 EDT 2003 | Andrea
I was recently given a copy of the "Tin Whisker Agency Action Notice" I was then asked to recommend and implement a action to prevent the suseptible components from reaching our stockroom. Since I can not commit my personel to activly research which
