Electronics Forum | Wed Mar 21 11:38:54 EDT 2007 | aj
Hi All, Can anyone advise supplier for the above mentioned parts ? Type 1 & Type 2 i.e. for SO8 & SO16 type components. Or even better a drawing of each. aj...
Electronics Forum | Thu Mar 22 11:40:04 EDT 2007 | cyber_wolf
Fuji does not sell individual lanes....you have to buy the $900 kit. Have your local machine shop build them for you. If you dont have a local machine shop, post here again and I may be able to help you.
Electronics Forum | Wed Apr 04 17:40:39 EDT 2007 | davef
Rob: How do you rework blow-holes and pin-holes? PTH plating thickness SB 1 thou or greater. Epoxy is hydroscopic. So, you should control the environment and/or bake the moisture from the boards before soldering. Search the fine SMTnet Archives f
Electronics Forum | Tue Apr 17 17:30:09 EDT 2007 | jaimebc
Our experience with leaded paste and SAC305, for 0402's, has been positive with the following stencil designs: 1.- 5 mil thickness. 2.- Home plate design. Hope it helps.
Electronics Forum | Tue May 22 09:37:11 EDT 2007 | jdengler
Hi Joakim, I do not know the QP242 table, but on our GP-341, CP-IV-2 and IP-III we make a plate from plexiglass with milled holes to show where the supports go for each board. This is not as fast as the Gridlock but does not cost nearly as much. J
Electronics Forum | Thu Jun 21 07:21:26 EDT 2007 | chrispy1963
5 mil is perfect for 0402's. If you are printing SnPb solder use apeture reduction such as home plating the pads. However, if youre using SAC, we've found that printing the entire pad works best due to poor wetting compared to SnPb paste. Chris
Electronics Forum | Thu Jul 05 14:15:28 EDT 2007 | 18424
I ran into the same thing several months ago, I increased my reflow zone temp 10 degrees and this corrected the problem. For some reason it has somthing to do with the plating on the component. I don't know what part you are running but Some of the M
Electronics Forum | Thu Jul 19 09:23:52 EDT 2007 | patrickbruneel
Chris, To my knowledge the only difference between leaded and lead-free components is the termination plating. What has changed in the component design that makes them resistant to higher temperatures?
Electronics Forum | Fri Jul 27 15:51:29 EDT 2007 | hussman
Well I agree with jdumont in the fact that you should reduce the center pad at least 50%. Generally the sides of the leaded ends are not plated and solder will not wick up. This means only the bottoms of the leads wil solder. Look in this area whe
Electronics Forum | Thu Jul 26 22:52:56 EDT 2007 | davef
Choices are: * Respin the board to move the via so that it is no longer under the pad. * Have the board fabricator plug and plate over the via. Search the fine SMTnet Archives for background.
