Electronics Forum | Wed Jan 29 17:19:50 EST 2003 | albertoh
Hello!! I need to know the land pattern specs for a melf resistor with dimensions length 0.415(+/-0.02) and width 0.144 (+/-0.008) inches. Because i have tombstone problem. My stencil design is 10 mils thickness in order to avoid the issue but it hel
Electronics Forum | Tue Feb 04 14:05:10 EST 2003 | bradlanger
I am haveing some trouble with ceramic capacitors breaking on a couple of boards I am running. The boards I have trouble with are in a 6 up and 12 up array and the caps are near the score lines where the individual boards are broken apart. Has anybod
Electronics Forum | Mon Feb 24 19:16:38 EST 2003 | Neil
Brad, This is a common problem and may relate to the design of the board. In all cases when a device such as a capacitor is place near the edge of the board and the board must be de-panelled, the capacitor must be parallel to the break line. If the
Electronics Forum | Wed Feb 05 11:21:24 EST 2003 | pjc
First off, get them designed out. I had this problem once and filled them with SMD adhesive and cured prior to printing. We were careful to be sure the solder lands were clean of any adhesive prior to curing. It worked out very well and we did this p
Electronics Forum | Mon Feb 10 15:39:20 EST 2003 | bpan
Thanks for all the info guys. Dont think that the problem is a thermal one and I believe the guys designing the board just need to design them out. I have directed the customers we get the boards from to read this posted question so that they could s
Electronics Forum | Tue Feb 11 11:16:46 EST 2003 | Chad
I believe I've seen some board houses advertise the ability to plate vias completely shut, so that they can be placed within the outlines of a pad without causing the problems you noted. I've seen this scheme used on very densely populated digital bo
Electronics Forum | Mon Feb 17 02:51:21 EST 2003 | Scott B
We have also had this problem. I have managed to get around this by selecting a teach video model and positioning the teach window to include half the pad on the left and half the pad on the right so that the center point is bang in the middle of the
Electronics Forum | Wed Feb 19 20:52:49 EST 2003 | davef
Consider that: * Something may be wrong with your glue. [That you have globs of flat glue on your board seems to indicate that your glue is probably cured properly. How easy is it to "pop" components from the board?] * Someone has put a goopy crud o
Electronics Forum | Tue Feb 25 15:29:46 EST 2003 | MA/NY DDave
Hi Locktite is telling you to cure first, maybe for a good reason. So the epoxy becomes stable just before solder reflow moves stuff around and around and then settles. A WEG yet if you did some cross sections and analysis you might find piles of
Electronics Forum | Tue Feb 25 23:17:12 EST 2003 | MA/NY DDave
Hi Up above in his operation / process description after a call to Locktite and then my note and then your note, we may have found the problem. One never knows at a distance. It appears he is striving to do soldering/reflow first and then concurren
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