Electronics Forum | Fri Feb 11 10:14:54 EST 2000 | C.K.
Dave, to answer your questions, point-by-point: � Just out of curiosity, how are second side, skippy components oriented on the board with respect to the wave? The SMD's are all oriented in the "correct" direction with respect to wave direction(i
Electronics Forum | Wed Feb 09 16:09:06 EST 2000 | Doug
Does anyone have any ideas on setting up a parts library/database on an SMT line? We would like to identify a particular part by it's package style, instead of by the customer's part number, in order to reduce the amount of entries in the library.
Electronics Forum | Wed Feb 09 21:37:37 EST 2000 | Dave F
Rob: Someone's out there turning over stones, eh? Roller Tinning, Rolled Solder. In printed circuit fabrication, a surface coating of tin-lead, typically 1-2 microns thick, applied to preserve solderability. Still available from some fabricators
Electronics Forum | Fri Jan 19 12:17:57 EST 2001 | slthomas
Thanks Dave. Talked to a few people at APEX this week and if nothing else, had my frustration reduced some. Of course I made sure I talked to mfg. people and avoided the design guys like the plague. ;) I actually picked up a copy of 785 a while bac
Electronics Forum | Fri Jan 05 12:01:26 EST 2001 | Jim M
I've been involved with no-clean flux and conformal coat in the past.It has been my experience that the amount of no-clean flux used is proportionate to how well the conformal coat adheres to the boards.No clean paste did not affect adhesion. The co
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Fri Dec 01 14:12:50 EST 2000 | Jim M.
My company currently uses water soluble paste for our SMT process. We were having trouble retaining hot water in our in line, closed loop DI cleaner. The cleaner kept shutting down when the water temp. dropped below 125C. As a result, the conveyor
Electronics Forum | Sun Dec 03 15:35:44 EST 2000 | Michael Nguyen
Wow. And I thought I was the only one having problem with ceramic capacitors.I too am having problem with cracking ceramic capacitors 1206 package.We changed vendors and still having the same problem. I had to reverify my entire process and I had to
Electronics Forum | Thu Nov 30 21:13:55 EST 2000 | Dave F
Can't find "WS601" on the Alpha site. What is that stuff? So, with nothing to go on, I'll just guess ... Yer probably cold welding the solder particles together. The nozzle size (inside diameter) determines the dot size. * With glue, small dot si
Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
