Electronics Forum | Mon Feb 10 12:35:11 EST 2020 | emeto
on 10 zone ovens with 3 cooling zones, my negative slope is between 2.5 to 4 deg C/second based on board size and thermal mass.
Electronics Forum | Wed Feb 12 08:10:49 EST 2020 | majdi4
We can't do that because we are using dual ligne reflow oven..So the two sides of PCB are soldered with the same reflow profil.
Electronics Forum | Tue Feb 11 10:31:20 EST 2020 | emeto
Values and range definitions on your profile attachment are for LF paste not for Tin Lead. Please recheck and redefine, so we get the correct values. Also, which location is the QFN?
Electronics Forum | Tue Feb 11 13:03:05 EST 2020 | astarotf
Evtimov The areas analyzed are a standard oven curve according to the pasta we are using. The channels used are only for measuring the oven temperature profile, not in detail of the QFN component sector.
Electronics Forum | Tue Feb 11 17:05:53 EST 2020 | astarotf
Evtimov thank you very much for sharing this profile, we will perform tests with this curve to see behaviors in the oven and pasta.
Electronics Forum | Thu Feb 20 07:48:16 EST 2020 | benreben
Hello, The oven profil is not the solution! The only solution for the solder mount on the side is to put gel flux on the side of qfn and make a second travel in reflow . The flux remove oxyde from the copper that is not tinned and the solder is able
Electronics Forum | Sun Feb 23 21:19:08 EST 2020 | sssamw
Yes, this is for tin-lead profile. And for the QFN pins which has copper exposed that not required and not possible to have fillet on side surface as in IPC, see 8.3.13, in IPC-A-610-G
Electronics Forum | Fri Mar 27 03:42:17 EDT 2020 | sssamw
Did you try 0.12 or 0.1mm nano coated stencil @ 10 mil aperture? A soak time type profile with long reflow time could help.
Electronics Forum | Fri May 01 13:23:14 EDT 2020 | stephendo
It could be the paste or the profile. (or something else) You should try changing those one at a time. Also maybe try less paste and using preforms.
Electronics Forum | Wed Jun 10 04:00:46 EDT 2020 | ameenullakhan
Hi Phil, we used RSS profile initially , because of tombstone issue at 0201 package. We are planning to reduce soak a now to have flux till the end of reflow to avoid HIP now. and to support that . we are increasing over aperture opening also. Re
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