Electronics Forum: profiling (Page 191 of 462)

QFN welding problem by reflux oven 10 zones

Electronics Forum | Tue Feb 11 13:03:05 EST 2020 | astarotf

Evtimov The areas analyzed are a standard oven curve according to the pasta we are using. The channels used are only for measuring the oven temperature profile, not in detail of the QFN component sector.

QFN welding problem by reflux oven 10 zones

Electronics Forum | Tue Feb 11 17:05:53 EST 2020 | astarotf

Evtimov thank you very much for sharing this profile, we will perform tests with this curve to see behaviors in the oven and pasta.

QFN welding problem by reflux oven 10 zones

Electronics Forum | Thu Feb 20 07:48:16 EST 2020 | benreben

Hello, The oven profil is not the solution! The only solution for the solder mount on the side is to put gel flux on the side of qfn and make a second travel in reflow . The flux remove oxyde from the copper that is not tinned and the solder is able

QFN welding problem by reflux oven 10 zones

Electronics Forum | Sun Feb 23 21:19:08 EST 2020 | sssamw

Yes, this is for tin-lead profile. And for the QFN pins which has copper exposed that not required and not possible to have fillet on side surface as in IPC, see 8.3.13, in IPC-A-610-G

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Fri Mar 27 03:42:17 EDT 2020 | sssamw

Did you try 0.12 or 0.1mm nano coated stencil @ 10 mil aperture? A soak time type profile with long reflow time could help.

SMT Stencil design

Electronics Forum | Fri May 01 13:23:14 EDT 2020 | stephendo

It could be the paste or the profile. (or something else) You should try changing those one at a time. Also maybe try less paste and using preforms.

HIP defect in BGA

Electronics Forum | Wed Jun 10 04:00:46 EDT 2020 | ameenullakhan

Hi Phil, we used RSS profile initially , because of tombstone issue at 0201 package. We are planning to reduce soak a now to have flux till the end of reflow to avoid HIP now. and to support that . we are increasing over aperture opening also. Re

HIP defect in BGA

Electronics Forum | Fri Jun 12 05:56:53 EDT 2020 | sssamw

I cannot see the logic connection between HIP and RSS or RTS, or between HIP and solder paste volume because volume is ok. Did you measured the BGA solder profile?

Reflow Oven Exhaust Temperature

Electronics Forum | Mon Jun 22 16:04:04 EDT 2020 | cyber_wolf

Using steel/aluminum duct work causes a radiator effect. Our Heller's have flexible rubber tubing coming off both ends that feed into a T above them. Just measured them at 57C on PbFree Profiles

TOMBSTONE defect Redution suggestion.

Electronics Forum | Thu Sep 10 19:26:24 EDT 2020 | emeto

Are parts always following the same side/direction of tombstone? 1. Run 180 and observe if tombstone moves or remains the same 2. Too much paste under the part - reduce aperture and move it out to the lead. 3. Soak profile for even heat distribution


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