Electronics Forum | Thu Aug 29 15:51:21 EDT 2019 | spoiltforchoice
&gt; If quality or Reliability is the key.... BTU, <BR> &gt; Soltec Vitronics..Rehm... If it is the money <BR> &gt; ...probably not these brands.....:) <BR> <BR> Well I
Electronics Forum | Tue Dec 03 10:21:11 EST 2002 | jimlew
I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. Here's the answers to your questions: Placement Force: 0201s are placed on the Siemens S23s with 1 newton of force. The s
Electronics Forum | Mon Mar 27 20:48:25 EST 2000 | Dave F
Robert: Howya doin' bud? You say "BGA Shorting!!!" I say "Too Much Solder!!!" So, earlier comments about aperture design are appropriate, make good points, and I think we both agree that improvements could be made in your stencil design, but I'm
Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker
Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv
Electronics Forum | Thu Nov 30 04:02:26 EST 2000 | Chris May
Michael, Thanks for your response. More info:- The processes are as follows, Stencil Print (6 thou on DEK 248) Placement on Contact 3AV and Reflow on BTU 4 zone Top & Bottom oven.It is not an In-Line system. Our board technology is mixed but heavi
Electronics Forum | Fri May 25 13:38:15 EDT 2007 | mfgengr
TAL Too Long - dull solder joints, dewetting. TAL Too Short - cold solder, insufficient wetting. You want TAL to be as short as possible (but not lower than 30 seconds), but long enough for every solder joint to be above TAL for at least 30 seconds.
Electronics Forum | Thu Jul 20 15:08:53 EDT 2000 | Bob Willis
Yes no problem here it is in a nut shell. The sponsor of my CD ROM on this process was Loctite who specifically developed a glue for the process to cure in less than 10seconds. Have a word with these guys they may even have a few CDs. PROCESS SEQUEN
Electronics Forum | Tue Feb 24 15:31:44 EST 2009 | pcbrookie
Wrongway - Interesting about the rails. I'll check to make sure operators are leaving a little 'wriggle room' on the rails in case they are in fact getting narrower in the middle. SWAG - I suspected the initial temp. might be a bit hot, thus causin
Electronics Forum | Wed Aug 22 22:07:53 EDT 2007 | mdm4ua
Easy fix is put a drop of washable mask on the side of part before reflow. The mask dries before the solder reflows and holds the part in place. After reflow it washes away.
Electronics Forum | Mon Oct 14 12:56:50 EDT 2002 | davef
His technical contribution to the forum. From these 24 postings, we can see that 75% of Sean�s postings have a decided commercial bent, as followings: * Could be argued that the posting is a good technical response. Percent of postings 25%. * Could
