Electronics Forum: reflow (Page 86 of 945)

Golden Finger contamination with Solder after reflow

Electronics Forum | Mon Nov 13 21:31:11 EST 2017 | slah6678

Hi David, thanks for reply We did doing some study, most properly this problem was due to reflow process. Any thing that we can do for the reflow profile ? slow down the ramp up rate or .....

Tin whisker growth testing PBfree reflow/snpb reflow

Electronics Forum | Tue Mar 26 06:07:58 EDT 2019 | pooja_4t

Hi i am referring Tin whisker report JESD201A class 2 standard from Vishay. i can see at TC -55/85C using pbfree reflow there are 0 growth at 500&1000 cycles. for snpb reflow and the same temperature and same cycle significant growth can be found. my

Water soluble solder mask for reflow soldering.

Electronics Forum | Thu Oct 17 00:34:59 EDT 2019 | jani

Hi, We have solder reflow use with water soluble flux and Tin/lead process. There is special glass component which needs to mask during reflow soldering and wash flux+solder mask post soldering. The existing solder mask does washes off. But leaves

Electrolytic caps for high temp reflow application

Electronics Forum | Fri Sep 22 12:37:18 EDT 2000 | jonyoder

I am having problems with SMT electrolytic capacitors expanding and changing values after going through our reflow. The reflow profile we use includes temperatures of 200 deg C for 60 seconds and 230 deg C for 30 seconds. We need to use this profil

discolored pbfree finish after bake and/or reflow

Electronics Forum | Thu Apr 20 22:14:51 EDT 2006 | raquel

hello! need ur inputs... if the Matte Sn pbfree finish of the component discolors AFTER having been exposed to bake, or, after reflow, will the base leadframe have any potential contribution to it? i know most likely suspects would be the plating pro

reflow CPU Socket Open Joint boards again

Electronics Forum | Wed Jul 26 12:39:00 EDT 2006 | spari77

we encounter some open joint on the CPU socket after rework. We tried to reflow the boards again (using BGA rework machine) and found that the contact issue was resolved. Is there any risk to perform a reflow again on the CPU Socket boards without re

OSP gets darker after sencond reflow

Electronics Forum | Wed Jan 04 07:32:35 EST 2017 | pavel_murtishev

Good day, Having recieved new batch of PCBs with OSP surface finish, I have noticed that some polygons not covered by solder mask and solder paste become darker after second reflow cycle compared to PCBs not being sent to reflow. I wonder whether i

Need Omniexcel dual conveyor reflow oevn software.

Electronics Forum | Tue Nov 07 06:36:39 EST 2023 | ravikumargv

Dear All. Good day.. We have one Omniexcel dual conveyor reflow and recently we had PC got gone bad and now we replaced new mother board and hard disk, but we don't have the previous PC backup, now we need the software. kindly help us to share the

Re: BGA problem: open after reflow

Electronics Forum | Tue Jan 30 02:38:50 EST 2001 | arul2000

This BGA could have gone through the reflow cycle two times as we understand from the BGA manufacturer, during the BGA ball attachment process. (If any ball is found missing, they replace the missed ball manually after applying flux manually and refl

lead free for multiple reflow process

Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam

We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l


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