Electronics Forum | Wed Nov 01 07:32:33 EST 2006 | davef
What you have run up against is the unfortunate consequence of the transition period from Sn-Pb to Pb-free. In the past 2-3 years there have been several studies highlighting the differences in reliability between mixed metal systems, Sn/Pb, and SAC
Electronics Forum | Sat Feb 19 05:07:28 EST 2000 | Dean
I'm not exactly sure of your problem...but I'll give it a shot. I assume the screw is on the solder side of the board. If you wave solder the screw the head will fill in with solder. Try a water solouble mask or peelable laytex mask over the screw
Electronics Forum | Mon Aug 28 14:12:51 EDT 2000 | Earl Moon
1/4 thimble! Obviously, you read none of may articles. HASL has more than a simple topographical problem, and so on. You also would know that TCE, while being an important issue, can be overcome as a problem with optimized pad designs. You would kno
Electronics Forum | Sat Feb 19 05:07:28 EST 2000 | Dean
I'm not exactly sure of your problem...but I'll give it a shot. I assume the screw is on the solder side of the board. If you wave solder the screw the head will fill in with solder. Try a water solouble mask or peelable laytex mask over the screw
Electronics Forum | Tue Jan 30 01:32:24 EST 2001 | PeteC
Bill, We do solderpaste reflow on through-hole here every day on plated-thru-holes. We do it on connectors only. It is a reliable process. We use no special profile. The stencil apertures must be modified for this process. Check out the IPC-7525 "St
Electronics Forum | Thu Mar 29 15:26:35 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Sat Jun 09 14:28:58 EDT 2001 | Kelvin
No-clean solder paste is definately a trend for tomorrow. However, there are several points you need to consider before you shift from WS to no-clean: 1. Component quality - No-clean solder paste generally (not essentially) get a lower avtivity than
Electronics Forum | Mon Jan 03 18:52:13 EST 2000 | Deon Nungaray
Hi John, I don't know if you are going to have a lot of luck obtaining this information. Currently 0201's are mostly used in Asia, and reliability issues have risen using these components. The problem is obtaining a reliable solder connection with a
Electronics Forum | Thu Oct 14 10:49:13 EDT 1999 | Dan Woodward
Andrew, As I read about issues with reworking connectors, whether they are surface mount or PTH soldered, I wonder if compliant pin pressfit connectors are being considered. They are easily assembled after all SMT without any thermal input, and on e
Electronics Forum | Tue Jul 27 14:04:38 EDT 1999 | JohnW
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
