Electronics Forum | Wed Jan 05 16:46:44 EST 2000 | Dennis O'Donnell
Several methods work well. 1. (Low Volume Method) Using an Xacto blade, scrape off the solder mask holding the blade flush being careful not to use the pointed part of the blade. 2. (High Volume Method)Tape off the area that you don't want the mas
Electronics Forum | Thu Apr 11 11:26:34 EDT 2002 | johnw
Dave, I sand corrected since I know you wouldn't steer me wrong...although the lst time I looked at the IPC spec for a solder profiel it was still designed for older generations of paste and were specifically water wash biased although that doesn't c
Electronics Forum | Mon Nov 11 11:28:32 EST 2002 | davef
Sand is not a great conductor, compared to copper. Never heard of using the stuff on RF boards. Our board fabricator uses Dupont CP100, now CP101, [or something like that cuse who's going to check?] when plugging via on cheap boards. Your board fa
Electronics Forum | Sat Dec 14 10:10:04 EST 2002 | davef
This is a good idea. Heck, you could fill the bags with sand, if you wanted. Like anything else in the shop, bean bags require attention and maintenance. If you don't, eventually the seams on the bags loosen / break and you have to do a "clean-u
Electronics Forum | Sun Dec 18 11:24:35 EST 2005 | fastek
Bert- There's alot of forums dealing with SMT and Fuji in particular but you'd have to be able to read Chinese. In China... being fairly new to this there are many help forums around designed to assist folks to get up to speed as quickly as possible
Electronics Forum | Tue May 30 16:02:04 EDT 2006 | slthomas
Do a dirty DoE...print ten boards with the worst error you think you can accept, build them up, and count print related defects. At the same time, print ten spot-on and proceed the same. If you don't have any more defects on the off-print batch show
Electronics Forum | Fri Sep 01 13:21:59 EDT 2006 | fastek
Stephen- I'm curious about your statement regarding someone mistakenly thinking it would be a good idea to get more done in China. I fail to see the mistake in such an approach. Consider if DEK or MPM felt that way a few years ago. They would both
Electronics Forum | Thu Nov 06 14:24:52 EST 2014 | wolverine
As part of the process of assembly, we have to scuff the surface of our board around the border about a half inch in from the edge before application of an adhesive. We have been doing this by hand with 60 grit sandpaper, we are looking for a way to
Electronics Forum | Thu Mar 02 18:15:01 EST 2000 | Stu Leech
How is the component marked. Is it ink marked, laser marked or what? What is the material that the marking on? What volume are you looking at? We used a small, pencil-sized sand blaster, loaded with bicarbonate of soda to errode the mark off of plast
Electronics Forum | Thu Mar 02 18:15:01 EST 2000 | Stu Leech
How is the component marked. Is it ink marked, laser marked or what? What is the material that the marking on? What volume are you looking at? We used a small, pencil-sized sand blaster, loaded with bicarbonate of soda to errode the mark off of plast
