Electronics Forum | Fri Apr 29 07:29:58 EDT 2005 | siverts
Steve, Thanks for Your replay and I agree with You. But sometimes I find it hard to always have the optimum in every aspect of our high mix/low volume electronics assembly production. We also do a lot of prototype production. In this case we had to g
Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | devajj
BTW, The surrounded QFN fine pitch terminals > should have the normal aperture reduction of 7 % > in case of RoHS Senju solder paste. This works > for our Telecom customer. > > The vias in the > ground pad will be somewhat filled with solder >
Electronics Forum | Mon Feb 04 08:32:12 EST 2008 | jola
Thanks for your replys but I can't figure out why this problem is so much bigger in one owen when we run nearly the same mix in both our lines and we use in 99% of the production only the same 2 different pastes, lead and leadfree. The pastes we use
Electronics Forum | Thu Dec 05 05:39:05 EST 2019 | oxygensmd
I know your application isn't BGA but the data sheet also mention about the peak temperature - 235 Celsius. For the LEDs you can reach higher temperature and I recommend to reach 225-235 Celsius. You will get significantly better results because the
Electronics Forum | Wed Aug 09 12:11:44 EDT 2023 | thecolonel97
We are currently experiencing an issue with one of our reflow ovens producing large amounts of flux crystals in the end of zone 12 and entrance of cooling zone. This has been going on for roughly around 4 years now, we are using Senju M705 lead free
Electronics Forum | Wed Aug 10 09:01:15 EDT 2005 | fctassembly
Hello Joseph, Sorry for the bad news but microcracking is a well known potential condition occuring with the SAC305 alloy. Microcracking is a condition being seen with many joints soldered with the SAC305 alloy. It is technically a shrinkage cavity
Electronics Forum | Tue Nov 25 05:20:20 EST 2014 | grimus
Could be. I am making overprint to achieve proper amount of solder paste inside hole. Now I am trying to reduce maximum overprint and compensate it with step - up stencil. This could reduce effect that some particles of solder paste are not gathering
Electronics Forum | Wed Feb 08 03:44:28 EST 2006 | fctassembly
Hello Amol, I continue to be amazed at the surprise engineers have on discovering that a non-eutectic alloy such as SAC305 displays micro-cracking and rough joints in a soldering process. There was a reason the electronics industry chose to use eutec
Electronics Forum | Mon Sep 06 10:21:10 EDT 2004 | pioneertechnology
Hi All We have been manufacturing lead free in the UK for about two years now in a fashion. Let me expalin. Two years ago we began to change over our wave solder machines to lead free process. We read all the articles and attended the seminars on
