Electronics Forum: solder a (Page 846 of 1481)

Re: Why not Tin

Electronics Forum | Fri Jun 18 15:39:47 EDT 1999 | Earl Moon

| What's wrong with the Tin? Just wondering | | MDCox | | | | Electroless silver had promise, from Alpha, but I don't know where this ended up. Also Omikron's "white" electroless tin is proported to be a good alternative, though I've never been a

RF applications..aqueos vs. no clean..HELP!!!!

Electronics Forum | Wed Mar 24 10:43:59 EST 1999 | Tim

Hi, I have a customer who's electronic assemblies produce RF. He is insisting upon aqueuos cleaning. We switched to a no clean solder years ago and no longer have an aqueous system. Is aqueous cleaning necessary to eliminate 'cross talk' of the s

Re: Loading leadless parts(passives)by hand

Electronics Forum | Thu Mar 04 16:40:06 EST 1999 | Dave F

| Hi, | | For hand placement you should see about 150-200 ppm of errors (solder, placement, values etc) on a board populated of types such as 1206, 0805, SOT, Tantalum etc. . As for solely wrong components (component at wrong location) you can usual

Re: STENCILS

Electronics Forum | Thu Jun 18 14:46:38 EDT 1998 | Igmar Grewar

| WHAT SHOULD THE RATIO BE OF STENCIL APERATURE TO PAD TO GET GOOD QUALITY RESULTS. BY THAT I MEAN, A MINIMM OF SOLDER BALLS, AND LITTLE TO NO BRIDGING, SHORTS, ETC.. | RIGHT NOW WE ARE USING A 1:1 RATIO, BUT ARE INVESTIGATING REDUCING THE APERATU

Connector is falling down in the second reflow

Electronics Forum | Tue Feb 11 10:51:20 EST 2020 | slthomas

To predict whether or not a first pass part is going to come off during the second pass you need to calculate the ratio of weight/soldered surface area. According to a couple of different sources that I've dug up, maximum is around 44 grams/in.^2. I

Whitish Solder Joint

Electronics Forum | Fri Apr 04 09:28:59 EST 2003 | davef

Q1: Anyone has any ideas on how this post-SMT reflow solder joint could have changed to whitish joint? A1: Dunno. You need to tell us more. For instance: * What is the appearance of this white residue? [eg, glassy / coarse, milky colored / opaque,

Type 4 & Type 5 Solder Paste- Process Control & Considerations?

Electronics Forum | Thu Nov 14 09:43:33 EST 2002 | MA/NY DDave

Hi I will only hit only a few and then bug out. Worked with one large EMS place that has the "fail first" approach to engineering and manufacturing. ( I know I know THEY all do). They didn't store the paste as the mfg suggested, they didn't control

SAC305 Water Soluble Pastes

Electronics Forum | Tue Jun 05 20:46:25 EDT 2007 | rfrog

I, too, have finished qualifying the Amtech paste for a dispensing application. We will be experimenting with the component soldering/stencil printing next. The stuff has proven to provide the best of both the no-clean/low solids and water washable

Solder Paste Inspection Systems

Electronics Forum | Fri Dec 28 14:31:42 EST 2007 | clampron

RC, I agree. I have tried to educate management as to the real benifits of height measurement. Our President attended a CEO meeting of some sort and was told that solder paste height measurement will solve all of the worlds problems. She then inquir

Radial capacitor placement

Electronics Forum | Fri Jun 18 15:37:44 EDT 2010 | remullis

One thing I have run into when placing cap's flush to the board is blow holes due to the plastic sheathing used around the cap. It would form a gasket going through wave and exhaust out of the holes therefore blowing the solder out with it. This cap


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