Electronics Forum | Sat Jun 13 07:08:46 EDT 1998 | Dave F
| Is their an IPC standard for the water that is being used in the water wash. I have been looking and at this time have not found any thing. Steve: A lot of the old command and control specification environment has changed with the "industrializati
Electronics Forum | Tue May 08 13:39:27 EDT 2001 | genny
Thank you for your response. I have been told that x-ray strength is finding solder volume and pattern root cause defects, and will catch a high % of them - opens, shorts, insufficient solder, and missing components(shape of solder on pad w/o lead i
Electronics Forum | Fri May 08 08:12:32 EDT 1998 | Steve Gregory
| I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am
Electronics Forum | Thu Nov 03 14:43:19 EST 2005 | chunks
Hmmmm.... We never had to change any parameters when switching over to Gels. And no, we don't let the operators have kitty-wampus on our programs either. The Gels did get rid of broken parts. We have Run Orders of about 50 pieces. We change over
Electronics Forum | Wed Jun 30 22:00:29 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, b
Electronics Forum | Thu Jul 01 16:52:31 EDT 1999 | JohnW
| | | | | | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a
Electronics Forum | Tue Oct 05 03:49:04 EDT 1999 | Chris May
| Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding so
Electronics Forum | Mon Jun 04 10:40:37 EDT 2012 | davef
I'm not aware of any such stipulation about witness [probe] marks for assembled boards, per se. Certainly, witness marks should not affect the intended performance of the assembly, you know, like damaging the solder connection or smudging solder mate
Electronics Forum | Wed Jul 03 10:37:41 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Thu Jun 12 11:12:08 EDT 2003 | babe
The last statement saying that seeing down the bga component with these systems is useless, is an incorrect statement. First with x-ray you do not see flux residue and or flux migration, second with x-ray you do not see a cold solder joint. Visual i
