Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se
| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
Electronics Forum | Wed Jan 09 21:19:49 EST 2002 | davef
When I said "In this area, there is no difference between your experience in ceramic substrates and PTFE substrates." I was referring to the area we were discussing ... gold plating. I am sorry if you thought I ment than the wire bonding process wa
Electronics Forum | Thu Jan 24 04:06:12 EST 2002 | wbu
Shawn: So, when was your last solderanalysis and what were the results ? Did this phenomenom occur just so, out of nowhere, and is it with all your boards? Just missed these points in your request. Wolfgang
Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef
They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm
Electronics Forum | Wed Jul 31 13:09:17 EDT 2002 | gdstanton
Anyone have experience with Indium NC-SMQ92J solder paste used in an inert (N2) reflow oven?
Electronics Forum | Wed Sep 11 07:23:07 EDT 2002 | johnw
peter, define what you class as SPC for these area's, or do you just mean looking at the PPM or DPM levels? John
Electronics Forum | Wed Sep 18 18:41:17 EDT 2002 | davef
People have made good comments. Additional points are: * Your bridging is probably being caused by one or more of the following: [1] printing too much paste, [2] smearing the paste during placement or subsequent handling, or [3] paste slump during t
Electronics Forum | Wed Sep 18 20:55:33 EDT 2002 | scottefiske
I'm with you dave...please provide specifics as to defect condition... Are you getting good wetting to both land and lead? Is there any repeatability to lead/location/device? Do you have paste inspection capabilites to verify deposition? Is it a Pala
Electronics Forum | Tue Aug 12 05:48:33 EDT 2003 | davef
There's an identical thread on this page. Look here: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6357&mc=7 Consider searching the fine SMTnet Archives when you are bored.
