Electronics Forum | Mon Jun 30 08:55:31 EDT 2008 | davef
It will be tough to find a dimensional thickness specification for HASL. IPC-6012 Table 3-2, line "Fused tin-lead or solder coat - Coverage and Solderable" states the requirement that there has to be complete coverage of solder on the land, and it mu
Electronics Forum | Tue Sep 30 13:55:37 EDT 2008 | realchunks
How do you normally solder it?
Electronics Forum | Thu Feb 04 09:09:07 EST 1999 | dave
Can anyone help me with the pros and cons of trying to wave solder tantalum and large (1812) ceramic capacitors. I do know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what problems I c
Electronics Forum | Thu Jun 06 15:52:38 EDT 2002 | dason_c
It is normal recommended by the paste supplier. Indium paste claim that it can worked on high temp/RH area. Also, check Aim solder web site and they have a good solder paste handling guideline. Internally, we control our environment not exceed 27C
Electronics Forum | Wed Jan 26 12:36:14 EST 2005 | Rob Wilson
I saw in a presentation that military testing of lead-free soldering for reliability has not gone well. Basically, unlike commercial applications where the alloys performed better they did worse when under the more extreme military and aerospace con
Electronics Forum | Fri Oct 12 08:19:12 EDT 2007 | davef
Michael We know you're just trying to have fun by getting us to respond. Going along with the game, if your solder is more expensive, requires more energy to melt, produces less reliable solder connectiuons, and is worse for the environment; how to
Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139
Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t
Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega
| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce
Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Electronics Forum | Fri Feb 05 09:39:58 EST 1999 | Dave F
| Can anyone help me with the pros and cons of trying to wave | solder tantalum and large (1812) ceramic capacitors. I do | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what proble
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