Electronics Forum | Tue Jul 12 20:03:13 EDT 2005 | Tom
Most Lead Free Solder suppliers are saying that stencil aperatures should go to 1:1 or have no change from previous stencils design. Only one solder supplier seems to be complicating the process....is their solder very different?? Can anyone share st
Electronics Forum | Tue Sep 12 19:36:17 EDT 2006 | davef
We've been soldering leadfree components for maybe 15 years. We'd be surprised not to be able to store components for at least a year, not that we purposely do that. Component fabricator process determine the maximum storage time for components. M
Electronics Forum | Mon Nov 12 19:47:33 EST 2007 | sin4d
Hi, Thanks. Waitng for your reponse. BTW, if I were to perform a test as below will this give me some result to indicate if the component is defective. 1) Print solder paste on plain PCB without copper track. 2) Mount the QFP & reflow 3) If the sol
Electronics Forum | Thu Aug 28 11:13:53 EDT 2008 | janz
Have you tried to run the same process but with diffrent solder paste manufacturer.? This give you information whether paste is ok. Try also print paste on the bare board and run through reflow oven. Check 2-3 boards. Is it the same places where i
Electronics Forum | Wed Mar 24 10:28:51 EDT 2010 | Sean
Hi all, Anyone used to come across solder void underneath mosfet as shown in the attached file? Will this pose any reliability issue, such as get burnt during functional test? How to over come this problem? As far as I know there is no acceptabl
Electronics Forum | Wed Mar 24 11:09:44 EDT 2010 | rajeshwara
Hello Sir I faced the same problem for QFP in DTH product in India. IPC stated that void should not be more than 25% of solder joint. But this type of void definatly create problem during functional test. Please check the folloeing point... 1.Check t
Electronics Forum | Thu Jun 23 23:58:03 EDT 2011 | jamessunderland
Just want to ask. What is the effect of dull gold surface on solderability? When I made a test run with several pieces containing dull gold defect on the pad(of varying levels), I found that components can still stick to the pad with good amount o
Electronics Forum | Wed Aug 24 12:37:38 EDT 2011 | hussman
Hello all, We just got some board back from thermal shock and we found that several of the 2512 resistors opened up. Actaully the solder joint cracked away from the board. All other coponents look great. Boards were good before test. 10 layer bo
Electronics Forum | Thu Apr 12 09:12:19 EDT 2018 | san_jeev490
Hello, currently I am being getting solder pot contamination test form my supplier and results found okay to except. during the audit question was raised on historical data analysis, I request can some help me by sharing excel graphical template to
Electronics Forum | Mon Nov 26 13:40:40 EST 2018 | robl
Hi Prem, Yes, the flux in the Cobar paste helped with wetting and joint strength, as does reducing voids as there is more solder in the joint, as does cooling rate. Regarding peel test in KG, it depends on the pad size and volume of solder in the j
