Electronics Forum | Thu Feb 18 17:15:24 EST 1999 | Jason Gregory
Check this company out....Winslow Automation. They have a real easy "preform" for reworking BGA's. You just wick the old solder off, flux the packages, attach an appropriate preform, reflow it with a corresponding profile, remove the water-soluble pa
Electronics Forum | Wed Jan 13 22:01:42 EST 1999 | Dave F
| This question is directed to anyone having eperience with Sn62Pb36Ag2 solder balls for BGA's. | Have you seen anything like a rough, raisin-like surface texture after ball attach? If so, what did you do about it? | | Thanks! | Jenna: We've used
Electronics Forum | Tue Jul 28 02:28:48 EDT 1998 | Bob Willis
The causes for solder on gold are: Paste wash offs Dirty stencils Dirty under stencil cleaning cloths/no solvent Poor handling The most common reason is wash offs when there is a couple of balls left on the tabs and they reflow. With correct profile
Electronics Forum | Thu May 26 10:47:28 EDT 2005 | james
What is the highest temperature set at in your oven and your belt speed. Also what type of oven do you have? Thanks much. Your right about alot of heat needed. We actually see the outside balls much flatter and soldered compared to the middle bal
Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken
I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col
Electronics Forum | Thu Dec 24 08:44:25 EST 1998 | Earl Moon
| | | | Folk's, | | | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colou
Electronics Forum | Fri Mar 27 05:11:24 EDT 2015 | robertwillis
If you want a step by step guide on BGA look at my NPL/IPC "Defect of the Month" video clips https://www.youtube.com/watch?v=MC4K0eSXH18 For other process issues there are also videos which may assist on other process issues like voids, solder ball
Electronics Forum | Thu Jul 23 11:39:16 EDT 1998 | Russ Miculich
Are you using a HASL board or an organic protection on the pads? This will help determine as to whether paste is necessary or just a very active/tacky flux should be used. Tight process control will also help in the reflow oven. Many users don't wan
Electronics Forum | Wed Oct 09 16:43:50 EDT 2002 | mjz289
Kester 256 has also worked tremendously well for us. We have soldered thousands of BGAs from 156 balls to 780 balls .8mm pitch with no solder problems (shorts,opens or voids) and no residue problems. Give it a try.
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
