Electronics Forum | Fri Jan 24 17:05:17 EST 2003 | Hoss67
DDave, I do not have the benefit of having the old machine here for comparison unfortunately. Comparing topside wetting to old sample boards run on the older machine show similar results. No solder balls. I have a thermal profiler and have run ma
Electronics Forum | Thu Sep 23 16:23:08 EDT 2004 | russ
Pb free pastes do not wet out like 63/37. Their are no claims from any manufacturers that I am aware of that say it will. Your "little solder balls" are likely caused from oxidization during reflow. What type paste are you using 3,4,5? What are t
Electronics Forum | Thu Sep 23 23:42:52 EDT 2004 | KEN
The LF pastes will have virtually NO wetting spread. This is normal. LF mobilities are virtually non-existant with SAC alloys. However, the addition of varrying amounts of silver can (and does) improve mobility but, this comes with a price (paste
Electronics Forum | Mon Jan 03 09:58:29 EST 2005 | Dave J
One of the difficulties with BGA rework is excessive heating of the internal package (die) temperature. We have several "SRT" hot air rework systems which work well, but with Pb-Free components the challenge becomes even greater. The question I have
Electronics Forum | Wed Jan 11 10:29:34 EST 2006 | chunks
Wow, you got off easy. He made a smock suggestion for ESD and next thing ya know we all had these stupid things that didn't fit right, get in the way and became a major pain in the arse (not to mention the people that never wash them. Stains are no
Electronics Forum | Thu Feb 02 09:06:53 EST 2006 | drewake
Sorry, I am jumping into this late - I'm a new user. Our company is looking to perform an evaluation for a new paste. We are looking at a 63/37 no clean - type 3 or 4. Our technology is currently at 0201s, .4mm pitch ICs & .5mm uBGAs. I have
Electronics Forum | Wed Feb 15 15:27:35 EST 2006 | russ
Put this one out a little early! I just looked at the data in the Kic site and also at the other place, it is interesting how the results are different except for the high temp solder which we should have all expected. Now for my question Do we re
Electronics Forum | Fri Feb 24 13:39:35 EST 2006 | Chunks
I agree with Jerry. A 7 mil stencil should work just fine for 25 mil pitch parts and 0.050 pitch BGA's. I too go 6 mil, but whith proper screen printing, you can 7 mil. You can always do 5 ot 10% reductions if needed. Use the homeplate design on
Electronics Forum | Thu Jul 26 13:08:59 EDT 2007 | Mike Konrad
The best method of cleaning misprinted boards is with a stencil cleaner. I would not recommend the use of a spray-in-air system for misprints. Spray systems can cause solder paste to become embedded into vias and under components (if double sided).
Electronics Forum | Mon May 27 15:11:25 EDT 2013 | ericrr
Interesting, I could not find anything via a website search some of the links came up as 404, others a "home" page and some never went at all (or took too long) So I turned to google and found http://www.smtinfo.net/docs/tombstoning.pdf a 16 page a
