Electronics Forum | Mon Jul 01 11:29:02 EDT 2013 | hegemon
I am guessing a lead free process. From the pictures, I don't neccessarily see any issues, perhaps the leads have wicked up a little too much solder, making the joint look a little starved. But I think I see nice toe and side fillets. In the worst c
Electronics Forum | Thu Nov 07 15:33:02 EST 2013 | mleber
Below are a few photos of an ongoing issue we are having with 1 pwb style. Some of the pads appear to have contamination that appears after the selective solder step. The joints are extremely hard to rework - almost impossible. We had the joints anal
Electronics Forum | Wed Nov 19 10:47:37 EST 2014 | grahamcooper22
Probably not all the overpinted paste is flowing onto the joint. You may need a paste with great coalescence properties so it all flows together, and doesn't leave any on the resist. Does the paste drip out the through hole too ? If so it suggests it
Electronics Forum | Fri Feb 20 10:27:37 EST 2015 | emeto
If you are in standard specs, don't even mention it. THe RoHS thing in electronics becomes more and more annoying. I haven;t seen people taking out PCBs from their electronic devices and start to chew them. So it was ok to use gas with Lead for deca
Electronics Forum | Thu Sep 30 13:37:08 EDT 1999 | Dave F
| | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | What is the best way to
Electronics Forum | Fri Oct 11 09:28:14 EDT 2002 | davef
Designers love to do BIG copper pours for several reasons: * Maximize heat spreading. * Increase EMI shielding. * Laziness. The poor folk that solder the parts on boards HATE big copper planes near solder pads. During soldering, fat copper traces [
Electronics Forum | Mon Jan 31 14:08:26 EST 2000 | Ashok Dhawan
I have got a number of assemblies back from a customer with feedback that the solder fillet is less than 25% of chip height per IPC-Standard-610B Class 2. Most of my joints are having good wetting but fillet height does not meet min ht requirement of
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN
I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f
Electronics Forum | Fri Apr 24 15:21:08 EDT 1998 | Earl Moon
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
