Electronics Forum | Thu Aug 26 13:09:08 EDT 1999 | Doug
I am building a board with T1/34 LED's in a 10X10 array there are 12 arrays in a panel. The LED's are body to body in the array, .1 spaced. The LEDS have been autoinserted on a Universal RAD III, so they are cut and clinched. The trouble I am having
Electronics Forum | Mon Aug 30 16:14:58 EDT 1999 | Dave F
| I am building a board with T1/34 LED's in a 10X10 array there are 12 arrays in a panel. The LED's are body to body in the array, .1 spaced. The LEDS have been autoinserted on a Universal RAD III, so they are cut and clinched. The trouble I am havin
Electronics Forum | Mon Nov 19 05:49:44 EST 2001 | Cheng
The BGA solder ball composition is 62/36/2 Sn/Pb/Ag, does any problem exist for the solder joint reliability? And what is the difference on SMTA process between this and the normal 63/37 ball?
Electronics Forum | Thu Apr 17 13:02:28 EDT 2003 | Takfire
Thanks Dave! What level of voiding is acceptable? Would you please let me know if there is an EIA or other industry standard detailing solder joint quality? I will begin researching the background information you provided. Thanks again for your kin
Electronics Forum | Thu May 26 21:13:17 EDT 2005 | thaqalain
Factors that affect the solder joint quality are *envirinmental condition(i.e.,humidity) *contamination *Flux residues *all of the above
Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
Electronics Forum | Fri May 29 23:11:08 EDT 2009 | isd_jwendell
Have you tried different board orientation through the oven, or have the boards been put through the same way each time?
Electronics Forum | Mon Jun 01 17:49:39 EDT 2009 | gregoryyork
Sorry looking at your profile again and considering its Aluminium substrate I would opt for an increase to the preheat or introduce a soak to the profile to get the PCB up to reflow. Try soaking between 175 - 200C sufficient enough to heat the whole
Electronics Forum | Thu Jan 19 13:28:19 EST 2012 | waveroom
Two pictures. Dark circles around solder joints. leaded solder, water soluble flux, selective soldering and seeing these dark lines circling around solder joints. Can not remove this either. Any idea what is making this occur??? See attached photos
Electronics Forum | Wed Apr 21 12:03:59 EDT 1999 | Michael N.
I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is about
