Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef
We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with
Electronics Forum | Wed Aug 12 11:09:42 EDT 2015 | jvalverde
Hello, I have a problem with the solder paste process, I need a solder paste with no Start-up Time because We do not work 24 hours in the manufacturing process, we works only 8 hours a day and at the finish we need to store the paste in the refr
Electronics Forum | Mon Jan 09 19:55:32 EST 2006 | davef
"Poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment * Proper aperture area ratio provide better release * Laser cut release better than chemical etched stencil 2 Process * Snap-off dis
Electronics Forum | Fri Jan 19 04:12:37 EST 2007 | AR
Hi I know that pump stencil technology can be used to print adhesive on boards with TH components already placed and clinched, but what about solder paste? The production sequence goes like this: First the jumper wires are placed and clinched with
Electronics Forum | Thu Aug 19 16:03:04 EDT 2010 | kpm135
Are you reusing your paste or putting down new every time? I've seen solder balls before when operators try to use the paste past the recomended stencil life. I've also seen it happen with a bad batch of solder paste from a vendor.
Electronics Forum | Wed Mar 05 16:29:56 EST 2008 | raincity1
You are playing with fire; you evaluate and specify paste for your products/SMT line, when you start adding tacky flux or whatever to your paste you don't really know what you are then dealing with - it osn't what you evaluated. We use solder paste f
Electronics Forum | Fri Mar 07 21:10:31 EST 2003 | neil
Remember the gold is only deposited to provide an air barrier so that the nickel does not oxidise. Normally the gold is absorbed into the solder joint so that the solder forms a joint with the nickle. It is not unusual to see gold remaining on pads i
Electronics Forum | Wed Jul 16 21:38:27 EDT 2003 | sam
I have done a DOE on the SMT components, not the BGA, for reducing void within the solder. The result did not help in the void reduction, but confirmed that the speed of the IR oven, solder paste thickness may be the important factors for the void.
Electronics Forum | Tue Sep 28 09:15:03 EDT 2004 | DenisM
Can anyone share with me the price you pay for LF solder paste? I have a chinese brand on hand that is purported to reflow well in air and leave shiny joints and minimal solder balls. It does not flow like lead based solder of course, nothing does.
Electronics Forum | Wed Dec 14 06:18:20 EST 2005 | tk380514
right again grant, consider the fact that if you spend enough time inspecting the soldered boards/pre-oven and check the BGA solder paste pads before, and clean the stencil regularly and check solder paste dryness, check oven profiles then after chec
