Electronics Forum: solder (Page 1686 of 2103)

Re: Glue dot question:

Electronics Forum | Thu Jun 29 12:36:10 EDT 2000 | Gary

You might try your search with the words Adhesive Dispenser. We recently evaluated machines from Asymtek, a Nordon company, Camalot, and Zmation, and GPD. There are several others. One consideration in the scenario you described is to make sure th

Re: HASL?

Electronics Forum | Thu Jun 29 10:11:06 EDT 2000 | John Thorup

Hi Bob, welcome Let's take this a little further. You'll also see HASL referred to as HAL and gold referred to as ENIG (electroless nickle, immersion gold. Other common surface finishes for preserving solderability include OSP(organic suface protect

Re: Solder Balls on 0805 capacitors

Electronics Forum | Tue Jun 27 10:51:42 EDT 2000 | Ioan

Hi Bill, there are a couple of things you should check. Most likely you have too much paste which is squashed at the insertion of the cap. - the paste height, around 7 mils should do. Too much paste will cause shorts under the cap at insertion which

Re: Aperture size for Micro BGA stencil

Electronics Forum | Thu Jun 22 11:21:59 EDT 2000 | Chrys Shea

My personal opinion: Use 20 mil squares with the corners radiused at 5 mils. The squares offer 2 benefits: 1) A little more paste, which makes for a higher diameter solder column that is more reliable 2) Better stencil release of the paste. It's e

Skewing chip components

Electronics Forum | Thu Jun 22 09:33:40 EDT 2000 | Sal

Guys Just completed a PI build. And for the first time found that some chip components are skewing. The board is approximately 8x8inches and is six layer double sided FR4. To minimise and eradicate solder balling all the chip components have been co

Re: applying DOE to SMT process

Electronics Forum | Tue Jun 20 20:22:15 EDT 2000 | Dave F

Hi Jack: Welcome!!!! Yours sounds like an interesting project. In response to your questions: A1. Each traditional L8 run requires 8 runs. So, how did you select a L8? A2. In addition solder height and volume as characteristics, consider deposit

Re: Perforated Tabs

Electronics Forum | Mon Jun 19 21:37:14 EDT 2000 | Dave F

Mike: Look a the Hadco DFM manual ( http://www.hadco.com/ ) Yano if you�re lookin� for uniformly smooth (not silky smooth) board edges, have you considered scoring to separate your boards? Scoring has: * Minuses (straight lines only, stress on so

Re: Soldermask Design Rules

Electronics Forum | Wed Jun 14 12:43:52 EDT 2000 | Todd Murphy

Dave, you are right you would expect the soldermask to be higher than all SMT pads on the pcb if it is higher on the fine pitch components, but the other areas of the board do not concern me as much as the fine pitch areas. The pads on all the other

Re: Delmat mechanical properties

Electronics Forum | Fri Jun 02 17:43:17 EDT 2000 | Dave F

James: I believe Delmat is a proprietary product. Check with some of the solder fixture fabricators in the archives. Continuing, I would not select knowingly Delmat as a board stiffener. It's a composite material similar to oriented strand board

Re: Home plate or bow tie?

Electronics Forum | Sat May 27 12:50:21 EDT 2000 | Micah Newcomb

Steve, I use homebase apertures as a standard for all chip parts and have no complaints, no solder beading, no issues. I have had to replace almost all stencils ordered previous to my arrival as they all caused defects (7-9mil thickness and 1:1


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