Electronics Forum | Wed Jul 21 17:49:52 EDT 2004 | jsk
problem: Too many solvents and boards are not clean Flux remains on the board after vapor degreaser and "Powdery" white residue after vapor degreasing Flux type is kester 186 Process: hand solder High Temp alloy, spot clean after hand solder e
Electronics Forum | Thu Aug 05 09:23:36 EDT 2004 | blnorman
We're using a RC filter network that we're having solderability problems with. There are 4 RC pairs with 2 ground connections (this is a leadless component). The problem we're having is non-wetting of one of the castellations (9 of the 10 scallops
Electronics Forum | Wed Aug 18 00:53:16 EDT 2004 | Grant
Hi, I think you cannot go wrong with Convection. If you want to experiment with VP, just get some of the fluid and put it into a pasta cooker on a standard domestic hot plate. Have a basin full of cold water so after reflow you can lift the cooker a
Electronics Forum | Sun Aug 29 19:17:34 EDT 2004 | aqueous
Chen, It is always best to place one�s effort on determining the cause and content of the residue rather than trying to work around it. The first thing you must determine is the nature of the residue. Is it flux? In many instances, the residue is
Electronics Forum | Thu Sep 02 10:51:45 EDT 2004 | patrickbruneel
Hi Ken, Thank you for the reply Ken. I hope I don�t get my behind in trouble for subject change in this thread. But you hit the nail on the head in your comment with Hitachi, when they converted to lead-free they had a �5 times higher defect rate� i
Electronics Forum | Tue Sep 21 11:39:41 EDT 2004 | pabloquintana
Conformal coat a bare board to determine if there > is there is enough surface free energy from your > solder mask to prevent dewetting. Sorry for my ignorance, but what is "enough surface free energy"? How do I determine that? >* Bake a board
Electronics Forum | Fri Sep 24 11:08:13 EDT 2004 | davef
We're not sure what you mean by temperature sensitive components. From an assembly process stand-point, every component we use is temperature sensitive to one level or another. More specifically, some of our products use polyphenylene sulfide (PPS)
Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Wed Nov 17 09:51:25 EST 2004 | AS
I'm looking for advise on setting up a prototype station for smt (we are currently outsourcing smt production, but have a need for rapid in house prototyping). The station must be able to handle only single sided boards with components no smaller th
Electronics Forum | Tue Dec 14 04:01:08 EST 2004 | paul_fisher
We have a problem with dendritic growth that is affecting a new board going into production. This is of concern because they were subjected to Damp Heat Cyclic Tests as part of the product validation testing during their development. Fails to date
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