Electronics Forum | Tue Feb 01 09:53:37 EST 2005 | Howard Sommerfeld
I also have a spreadsheet tool for comparative analysis using criterion weighted scoring. It can be used to analyze any decision, and helps groups reach consensus on why a particular alternative is the way to go. As final steps you can also consider
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
Electronics Forum | Wed Feb 02 21:56:11 EST 2005 | davef
Based on X-ray imaging, IPC-7095 standard specifies three categories for void size for BGA solder joints. These categories are based on the percentage of joint cross sectional area occupied by the voided area. Class III Small: Void area is LT 9% Cla
Electronics Forum | Thu Feb 10 09:25:44 EST 2005 | lyrtech
Hi, Actually we're looking for a new reflow oven regarding lead-free process and higher capacity production. We have an opportunity for a second hand Electrovert Omniflo-7 (nitrous ready) that respect our budget. My questions are: Does anyone ha
Electronics Forum | Fri Feb 18 13:26:49 EST 2005 | GS
Thanks Dan. Q. to all : any EMS experience like when your Customer audits your facility for manufacturing readiness and when they ask you: what about control of component vintage ? or how do you handle the component shelf life on your facility? etc
Electronics Forum | Mon Feb 21 04:04:21 EST 2005 | abhirami
1.67 always on the sample boards measured. This is very fast and pretty good measurement for a paste dispense control. Boards do not stand out-side for long times. Inspect the height for critical components only, in the initial stages. Once your Cpk
Electronics Forum | Tue Feb 22 07:58:16 EST 2005 | davef
We hear you. If it's not broken, why fix it? Right? Well intentioned, but not very educated customers seems to be part of the bane of existance of process engineers at contractors. First, as a previous poster said, paste height is an improper mea
Electronics Forum | Thu Mar 03 18:09:06 EST 2005 | gpaelmo
We also use Indium NC-SMQ92J. We do the same as mentioned per Russ. We reduce apertures mostly on QFP's with pitch of 25 mil or less (we place down to 15 mil QFP). All other apertures we keep 1:1. We print resnet 0805 size with no problems. You might
Electronics Forum | Mon Mar 07 09:44:49 EST 2005 | anonomous
The machine sees a magazine, but with wrong number. somehow one (maybe more) wire from the magazine bus does not reach slot 3, as the other slots work, there is probably not a short, as the magazine bus work for other slots, the problem is probably i
Electronics Forum | Mon Mar 07 20:27:07 EST 2005 | KEN
Oh silver and its...improved solderability over tin / copper. BS if you ask me. Look to your flux and thermal profile for wetting spread. Ask yourself just how much "wetting spread" do you need to fill a barrel? I have the same 100% barrel fill
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