Electronics Forum | Thu Jan 28 13:23:18 EST 2010 | plerma
i agree, with the other fellow, check the data sheet for the part and see what it can handle otherwise hand assemble.
Electronics Forum | Fri Jan 22 14:18:21 EST 2010 | davef
Search the fine SMTnet Archives to find threads like: * http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=5127 * http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=9250
Electronics Forum | Wed Jan 27 12:23:33 EST 2010 | patrickbruneel
This flux will hold up very well to your required settings. http://www.interfluxusa.com/Datasheets/PDF/IF2005Mz-(DSRev08).pdf
Electronics Forum | Thu Feb 04 14:02:59 EST 2010 | baildl632
We use Hot Mill Gloves, North by Honeywell. Their part number is 51/7146ZJ. I think they work pretty good. We pay about 4.03 per pair.
Electronics Forum | Fri Feb 05 09:40:45 EST 2010 | denisp
Hi! i would like to have opinion about the solder paste release. is it better on a 5mil or 6 mil thickness stencil? thank you!
Electronics Forum | Sun Feb 07 10:51:09 EST 2010 | davef
The ratio of aperture opening area to aperture wall area is a critical evaluation measure for the release of the printed solder paste. The stencil thickness has the biggest impact on area ratio.
Electronics Forum | Sat Feb 06 16:28:09 EST 2010 | mystkldy
I have some large ROHS SMT inductors that are moving during the reflow process. I have tried adding extra solder, gluing and doing both. I don't know what else to try, any suggestions?
Electronics Forum | Mon Feb 08 20:09:49 EST 2010 | davef
Woody: Consider using test BGA with no chip in, but daisy chains that you can monitor. After soldering, run environmental tests and follow with electrical tests to determine if the product concept is good enough.
Electronics Forum | Fri Feb 19 06:09:10 EST 2010 | lococost
feels more like a bit of propaganda. Am I missing something or is leadfree totally irrelevant in the case of Toyota's problems. Surely they are still using leaded solder???
Electronics Forum | Wed Feb 24 01:04:08 EST 2010 | dashley
Is it necessary, or beneficial to apply solder paste on the PCB pads for QFN rework? It seems that using micro stencils is not the best approach. Any guidelines or suggestions available for paste deposition techniques?
