Electronics Forum | Tue Aug 24 15:15:43 EDT 1999 | John Thorup
| Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | Any help would be appreciated. Thanks. | Most common reason is uneven heating where one side of the component ach
Electronics Forum | Wed Aug 25 21:51:13 EDT 1999 | Jason Tomlinson
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
Electronics Forum | Fri Aug 20 16:00:20 EDT 1999 | Earl Moon
| Has anybody run across a good concise book or other source on solder paste, its characteristics, handling, storage, stencil design, printing and reflow? Yes I asking for the world! | | TX | Mark | As the world turns, or is/was that a soap my x/fu
Electronics Forum | Fri Aug 20 22:43:14 EDT 1999 | ScottM
| Has anybody run across a good concise book or other source on solder paste, its characteristics, handling, storage, stencil design, printing and reflow? Yes I asking for the world! | | TX | Mark | SMT Magazine published a supplement "Pathways to
Electronics Forum | Fri Aug 20 10:18:32 EDT 1999 | Dennis Fall
I have a layer of electroplated solder (10/90) that appeares to have some sort of contaminent on it. Water will not wet to the layer in some areas. I have tried using 10% HCl in DI as a cleaner as well as 7.5% Fluoboric acid in DI. Neither has tou
Electronics Forum | Wed Aug 18 16:26:21 EDT 1999 | Tony
Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. This is what I did. Created a removal profile, I had a board
Electronics Forum | Mon Aug 23 11:36:22 EDT 1999 | Phil B
| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u
Electronics Forum | Thu Aug 12 10:50:19 EDT 1999 | John Thorup
| Hello everyone, | | I would like to know more about the so called FACETED or "Mirror ball" surface apperance. Its cause and how to eliminate / corrective actions for it. | | pls. help... | | thanks and best regargs, | ...Omat | Omat While I hav
Electronics Forum | Tue Aug 10 11:12:27 EDT 1999 | Steve_S
| Folk's, | | I'm looking for some helpful suggestions for reworking wave soldered bottomside components that have been glued. | I'm not a fan of the twist and break approach and as some of them either have a double dot or a slot configuration this
Electronics Forum | Fri Jul 30 15:22:52 EDT 1999 | M.L
| Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly app
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